Dynamic Crack Interaction in Piezoelectric and Anisotropic Solids

Author(s):  
Petia Dineva ◽  
Dietmar Gross ◽  
Ralf Müller ◽  
Tsviatko Rangelov
2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Sansit Patnaik ◽  
Fabio Semperlotti

AbstractThis study presents the formulation, the numerical solution, and the validation of a theoretical framework based on the concept of variable-order mechanics and capable of modeling dynamic fracture in brittle and quasi-brittle solids. More specifically, the reformulation of the elastodynamic problem via variable and fractional-order operators enables a unique and extremely powerful approach to model nucleation and propagation of cracks in solids under dynamic loading. The resulting dynamic fracture formulation is fully evolutionary, hence enabling the analysis of complex crack patterns without requiring any a priori assumption on the damage location and the growth path, and without using any algorithm to numerically track the evolving crack surface. The evolutionary nature of the variable-order formalism also prevents the need for additional partial differential equations to predict the evolution of the damage field, hence suggesting a conspicuous reduction in complexity and computational cost. Remarkably, the variable-order formulation is naturally capable of capturing extremely detailed features characteristic of dynamic crack propagation such as crack surface roughening as well as single and multiple branching. The accuracy and robustness of the proposed variable-order formulation are validated by comparing the results of direct numerical simulations with experimental data of typical benchmark problems available in the literature.


2004 ◽  
Vol 2 (1) ◽  
pp. 101-111 ◽  
Author(s):  
Zihai Shi ◽  
Masaki Suzuki ◽  
Masayasu Ohtsu

2012 ◽  
Vol 36 (5) ◽  
pp. 651-657 ◽  
Author(s):  
Jun Lei ◽  
Yue-Sheng Wang ◽  
Yifeng Huang ◽  
Qingsheng Yang ◽  
Chuanzeng Zhang

1994 ◽  
Vol 60 (571) ◽  
pp. 720-727
Author(s):  
Akira Simamoto ◽  
Makoto Kosai ◽  
Albert Kobayashi S.

2000 ◽  
Vol 23 (3) ◽  
pp. 299-305
Author(s):  
Zhenhan Yao ◽  
Zhihong Zhou ◽  
Bo Wang

1998 ◽  
Vol 539 ◽  
Author(s):  
T. Cramer ◽  
A. Wanner ◽  
P. Gumbsch

AbstractTensile tests on notched plates of single-crystalline silicon were carried out at high overloads. Cracks were forced to propagate on {110} planes in a <110> direction. The dynamics of the fracture process was measured using the potential drop technique and correlated with the fracture surface morphology. Crack propagation velocity did not exceed a terminal velocity of v = 3800 m/s, which corresponds to 83%7 of the Rayleigh wave velocity vR. Specimens fractured at low stresses exhibited crystallographic cleavage whereas a transition from mirror-like smooth regions to rougher hackle zones was observed in case of the specimens fractured at high stresses. Inspection of the mirror zone at high magnification revealed a deviation of the {110} plane onto {111} crystallographic facets.


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