Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

2019 ◽  
Keyword(s):  
High Temperature ◽  
Microelectronics Packaging ◽  
Die Attach ◽  
Temperature Applications

Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

2019 ◽  
Vol 774 ◽  
pp. 487-494 ◽  
Author(s):  
Hongqiang Zhang ◽  
Wengan Wang ◽  
Hailin Bai ◽  
Guisheng Zou ◽  
Lei Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Devices ◽  
Mechanical Evolution ◽  
Die Attach ◽  
Silver Sintering ◽  
Temperature Applications

Silver micropowders as SiC die attach material for high temperature applications

2012 ◽  
Author(s):  
Ryszard Kisiel ◽  
Zbigniew Szczepanski ◽  
Piotr Firek ◽  
Jakub Grochowski ◽  
Marcin Mysliwiec ◽  
...  
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

Reliability of sintered Ag80–Al20 die attach nanopaste for high temperature applications on SiC power devices

2013 ◽  
Vol 53 (3) ◽  
pp. 473-480 ◽  
Author(s):  
Vemal Raja Manikam ◽  
Khairunisak Abdul Razak ◽  
Kuan Yew Cheong
Keyword(s):  
High Temperature ◽  
Power Devices ◽  
Die Attach ◽  
Temperature Applications

SiC Die Attach for High-Temperature Applications

2013 ◽  
Vol 43 (3) ◽  
pp. 695-701 ◽  
Author(s):  
A. Drevin-Bazin ◽  
F. Lacroix ◽  
J. -F. Barbot
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

2018 ◽  
Vol 87 ◽  
pp. 232-237 ◽  
Author(s):  
Shuji Nishimoto ◽  
Seyed Ali Moeini ◽  
Toyo Ohashi ◽  
Yoshiyuki Nagatomo ◽  
Patrick McCluskey
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

An overview of die-attach material for high temperature applications

2017 ◽  
Author(s):  
Kim Seah Tan ◽  
Norasiah Mohammad Noordin ◽  
Kuan Yew Cheong
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications
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