Bending strain tolerance of BPSCCO-2223 tapes

1996 ◽  
Vol 46 (S3) ◽  
pp. 1697-1698 ◽  
Author(s):  
Maria Teresa Malachevsky ◽  
Daniel Antonio Esparza ◽  
Claudio Alberto D’Ovidio

2018 ◽  
Vol 28 (3) ◽  
pp. 1-5 ◽  
Author(s):  
Julien Avronsart ◽  
Christophe Berriaud ◽  
Xavier Chaud ◽  
Clement Hilaire ◽  
Mario Kazazi ◽  
...  


2006 ◽  
Vol 43 ◽  
pp. 543-546 ◽  
Author(s):  
M K Al-Mosawi ◽  
B Xu ◽  
C Beduz ◽  
Y Yang ◽  
N G Stephen


1997 ◽  
Vol 10 (4) ◽  
pp. 227-234 ◽  
Author(s):  
M J Naylor ◽  
S Fox ◽  
J C Moore ◽  
S K Wivell ◽  
C R M Grovenor


2016 ◽  
Vol 29 (4) ◽  
pp. 045002 ◽  
Author(s):  
P Kováč ◽  
I Hušek ◽  
T Melišek ◽  
M Kulich ◽  
L Kopera


Cryogenics ◽  
2012 ◽  
Vol 52 (12) ◽  
pp. 767-770 ◽  
Author(s):  
Syju Thomas ◽  
Neson Varghese ◽  
S. Rahul ◽  
K.M. Devadas ◽  
K. Vinod ◽  
...  


1995 ◽  
Vol 24 (5) ◽  
pp. 271-274 ◽  
Author(s):  
Sun-Li Huang ◽  
Berndt Schoenwaelder ◽  
David Dew-Hughes ◽  
C.R.M. Grovenor


2015 ◽  
Vol 25 (2) ◽  
pp. 1-7 ◽  
Author(s):  
Pavol Kovac ◽  
Lubomir Kopera ◽  
Tibor Melisek ◽  
Gustavo Sarmiento ◽  
Santiago Sanz Castillo ◽  
...  




Author(s):  
Byoung-Joon Kim ◽  
Hae-A-Seul Shin ◽  
In-Suk Choi ◽  
Young-Chang Joo

Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.



2020 ◽  
pp. 108128652097275
Author(s):  
Miroslav Šilhavý

The paper presents a coordinate-free analysis of deformation measures for shells modeled as 2D surfaces. These measures are represented by second-order tensors. As is well-known, two types are needed in general: the surface strain measure (deformations in tangential directions), and the bending strain measure (warping). Our approach first determines the 3D strain tensor E of a shear deformation of a 3D shell-like body and then linearizes E in two smallness parameters: the displacement and the distance of a point from the middle surface. The linearized expression is an affine function of the signed distance from the middle surface: the absolute term is the surface strain measure and the coefficient of the linear term is the bending strain measure. The main result of the paper determines these two tensors explicitly for general shear deformations and for the subcase of Kirchhoff-Love deformations. The derived surface strain measures are the classical ones: Naghdi’s surface strain measure generally and its well-known particular case for the Kirchhoff-Love deformations. With the bending strain measures comes a surprise: they are different from the traditional ones. For shear deformations our analysis provides a new tensor [Formula: see text], which is different from the widely used Naghdi’s bending strain tensor [Formula: see text]. In the particular case of Kirchhoff–Love deformations, the tensor [Formula: see text] reduces to a tensor [Formula: see text] introduced earlier by Anicic and Léger (Formulation bidimensionnelle exacte du modéle de coque 3D de Kirchhoff–Love. C R Acad Sci Paris I 1999; 329: 741–746). Again, [Formula: see text] is different from Koiter’s bending strain tensor [Formula: see text] (frequently used in this context). AMS 2010 classification: 74B99



Sign in / Sign up

Export Citation Format

Share Document