Effective methods for fabricating trapezoidal shape microchannel of arbitrary dimensions on polymethyl methacrylate (PMMA) substrate by a CO2 laser

2017 ◽  
Vol 93 (1-4) ◽  
pp. 1079-1094 ◽  
Author(s):  
SiJie Zhang ◽  
Yung C. Shin
2022 ◽  
Vol 572 ◽  
pp. 151424
Author(s):  
Milan Trtica ◽  
Miroslav Kuzmanovic ◽  
Jelena Savovic ◽  
Dragan Rankovic

2011 ◽  
Vol 48 (4) ◽  
pp. 041401
Author(s):  
李晓宇 Li Xiaoyu ◽  
陈继民 Cheng Jimin ◽  
刘富荣 Liu Furong ◽  
李晓刚 Li Xiaogang ◽  
张强 Zhang Qiang

2019 ◽  
Vol 26 (08) ◽  
pp. 1950042 ◽  
Author(s):  
XUEYE CHEN ◽  
TIECHUAN LI ◽  
QI GAO

In this paper, we present a new method that is capable of manufacturing microfluidic chips of polymethyl methacrylate (PMMA) rapidly and cheaply. This technique, which we call Tape adhering-Laser Cutting and Sealing Integration (TLCSI), only utilizes a CO2 laser and a piece of double-sided tape to produce a microfluidic chip in several minutes. It only has three main steps. First, the double-sided tape sticks to the surface of a PMMA substrate. Second, the microchannel should be cut on the surface of the double-sided tape. At last, a PMMA cover plate with liquid pools is pressed onto the surface of the double-sided tape and a CO2 laser is used to cut edges of the chip for sealing the chip. We present a qualified microfluidic chip with regular microchannels and sealing strength of 1.2[Formula: see text]Mpa. Compared with most current fabrication methods, TLCSI is a quick and cost-effective way to produce microfluidic chips of PMMA.


2014 ◽  
Vol 7 (1) ◽  
pp. 30-39
Author(s):  
Rana M. Taha

Laser sources are used in a large variety of applications for material processing. It is mainly used for welding, cutting, drilling, laser annealing, etc. This study narrows the scope down to one of the process, namely, laser drilling.The hole depth, width and penetration velocity of evaporation depend on different parameters such as power, material, exposure time, distance between drilling tool and the material, the drilling tool, etc. In this paper; the laser beam was used as drilling tool. 16W CO2 laser (10.6μm) and transparent Perspex (PMMA) which is the abbreviation of polymethyl methacrylate work piece with 8mm thickness were used. The distance between laser beam and the material was 5cm. Different powers for CO2 laser were used for different exposure time. Hole depth, time required for boiling, heat flow per unit area and penetration velocity of evaporation were calculated. Measured and calculated results were approximately the same. Many figures which representing the relations between laser power, time to reach boiling, hole width, hole depth and exposure time were obtained by using Matlab 2008 software program


Sign in / Sign up

Export Citation Format

Share Document