A surface micromachining process for suspended RF-MEMS applications using porous silicon

2003 ◽  
Vol 9 (6-7) ◽  
pp. 470-473 ◽  
Author(s):  
Y. Ding ◽  
Z. Liu ◽  
L. Liu ◽  
Z. Li
2002 ◽  
Vol 50 (1) ◽  
pp. 71-79 ◽  
Author(s):  
Peng Cong ◽  
Tian-Ling Ren ◽  
Jian-She Liu ◽  
Li-Tian Liu

2012 ◽  
Vol 21 (4) ◽  
pp. 867-874 ◽  
Author(s):  
Yonghyun Shim ◽  
Zhengzheng Wu ◽  
Mina Rais-Zadeh

2003 ◽  
Author(s):  
Hans Artmann ◽  
Frank Schaefer ◽  
Gerhard Lammel ◽  
Simon Armbruster ◽  
Hubert Benzel ◽  
...  

2001 ◽  
Author(s):  
Peng Cong ◽  
Li-Tian Liu ◽  
Yong Ding

2011 ◽  
Vol 483 ◽  
pp. 457-460
Author(s):  
Guo Ping Du ◽  
Jian Zhu ◽  
Yuan Wei Yu ◽  
Shi Xing Jia ◽  
Li Li Jiang

In this paper, a novel RF MEMS switch driven by combs with low insertion loss is presented. The developed SPST RF MEMS switch with a lateral resistive contact and gold structure layer on a silicon substrate has been fabricated by surface micromachining process. The RF performance of the switch indicates an insertion loss below 0.30 dB at 20 GHz, a return loss better than 20 dB and isolation greater than 30 dB. Good RF characteristics have been achieved by the large contact area and a lateral Au-to-Au resistive contact.


2022 ◽  
Vol 138 ◽  
pp. 106314
Author(s):  
Yaman Afandi ◽  
Giacinta Parish ◽  
Adrian Keating

2001 ◽  
Author(s):  
Peng Cong ◽  
Yanxiang Liu ◽  
Tian-Ling Ren ◽  
Li-Tian Liu

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