A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch

Author(s):  
Bo Liu ◽  
Zhiqiu Lv ◽  
Zhihong Li ◽  
Xunjun He ◽  
Yilong Hao
2011 ◽  
Vol 483 ◽  
pp. 457-460
Author(s):  
Guo Ping Du ◽  
Jian Zhu ◽  
Yuan Wei Yu ◽  
Shi Xing Jia ◽  
Li Li Jiang

In this paper, a novel RF MEMS switch driven by combs with low insertion loss is presented. The developed SPST RF MEMS switch with a lateral resistive contact and gold structure layer on a silicon substrate has been fabricated by surface micromachining process. The RF performance of the switch indicates an insertion loss below 0.30 dB at 20 GHz, a return loss better than 20 dB and isolation greater than 30 dB. Good RF characteristics have been achieved by the large contact area and a lateral Au-to-Au resistive contact.


2020 ◽  
Vol 12 ◽  
Author(s):  
Pampa Debnath ◽  
Ujjwal Mondal ◽  
Arpan Deyasi

Aim:: Computation of loss factors for one-bit RF MEMS switch over Ku, K and Ka-band for two different insulating substrates. Objective:: Numerical investigation of return loss, insertion loss, isolation loss are computed under both actuated and unactuated states for two different insulating substrates of the 1-bit RF MEMS switch, and corresponding up and down-capacitances are obtained. Methods:: The unique characteristics of a 1-bit RF MEMS switch of providing higher return loss under both actuated and unactuated states and also of isolation loss with negligible insertion loss makes it as a prime candidate for phase shifter application. This is presented in this manuscript with a keen focus on improvement capability by changing transmission line width, and also of overlap area; where dielectric constant of the substrate also plays a vital role. Results:: The present work exhibits very low down-capacitance over the spectrum whereas considerable amount of up-capacitance. Also when overall performance in terms of all loss parameters are considered, switch provides very low insertion loss, good return loss under actuated state and standard isolation loss. Conclusion:: Reduction of transmission line width of about 33% improved the performance of the switch by increasing isolation loss. Isolation loss of -40 dB is obtained at actuated condition in higher microwave spectra for SiO 2 at higher overlap area. Down capacitance of ~ 1dB is obtained which is novel as compared with other published literature. Moreover, a better combination of both return loss, isolation loss and insertion loss are reported in this present work compared with all other published data so far.


Author(s):  
Mehrdad Khodapanahandeh ◽  
Akbar Babaeihaselghobi ◽  
Habib Badri Ghavifekr

Author(s):  
K. Srinivasa Rao ◽  
Ch. Gopi Chand ◽  
Reshmi Maity ◽  
N. P. Maity ◽  
K. Girija Sravani

2014 ◽  
Vol 50 (23) ◽  
pp. 1720-1722 ◽  
Author(s):  
A. Attaran ◽  
R. Rashidzadeh ◽  
R. Muscedere

Author(s):  
Z. Wang ◽  
B. Jensen ◽  
J.L. Volakis ◽  
K. Saitou ◽  
K. Kurabayashi
Keyword(s):  
Rf Mems ◽  

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