Hollow metallic microneedles fabricated by combining bulk silicon micromachining and UV–LIGA technology

2011 ◽  
Vol 18 (1) ◽  
pp. 37-42 ◽  
Author(s):  
Xiao-Xiao Yan ◽  
Jing-Quan Liu ◽  
Xiu-Cheng Shen ◽  
Chun-Sheng Yang
Keyword(s):  
Bulk Silicon ◽  
Liga Technology ◽  
Silicon Micromachining

Multi-layer microstructure fabrication by combining bulk silicon micromachining and UV-LIGA technology

2007 ◽  
Vol 38 (1) ◽  
pp. 120-124 ◽  
Author(s):  
Xiang-meng Jing ◽  
Di Chen ◽  
Dong-ming Fang ◽  
Chuang Huang ◽  
Jing-quan Liu ◽  
...  
Keyword(s):  
Bulk Silicon ◽  
Microstructure Fabrication ◽  
Liga Technology ◽  
Silicon Micromachining

Application of Porous Silicon to Bulk Silicon Micromachining

1996 ◽  
Vol 459 ◽  
Author(s):  
G. Kaltsas ◽  
A. G. Nassiopoulos
Keyword(s):  
Porous Silicon ◽  
Smooth Surface ◽  
Sacrificial Layer ◽  
Monocrystalline Silicon ◽  
Back Side ◽  
Bulk Silicon ◽  
Free Standing ◽  
Integrated Devices ◽  
Silicon Micromachining ◽  
Deep Cavities

ABSTRACTA fully C-MOS compatible process for bulk silicon micromachining using porous silicon technology and front-side lithography is developed. The process is based on the use of porous silicon as a sacrificial layer for the fabrication of deep cavities into monocrystalline silicon, so as to avoid back side lithography. Cavities as deep as several hundreds of micrometers are produced with very smooth surface and sidewalls. The process is used to produce : a) suspended monocrystalline silicon membranes, b) free standing polysilicon membranes in the form of bridges or cantilevers with lateral dimensions from a few μms to several hundreds of μms. Important applications to silicon integrated devices as sensors, actuators, detectors etc., are foreseen.

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