Anti-plane crack problem of a functionally graded piezoelectric materials strip with arbitrarily distributed properties

2019 ◽  
Vol 231 (3) ◽  
pp. 1029-1043
Author(s):  
Zhi-hai Wang ◽  
Yuan-jie Kong ◽  
Feng-yun Sun ◽  
Tao Zeng ◽  
Xiao-hong Wang ◽  
...  
Keyword(s):  
Piezoelectric Materials ◽  
Crack Problem ◽  
Functionally Graded ◽  
Plane Crack ◽  
Functionally Graded Piezoelectric Materials ◽  
Functionally Graded Piezoelectric

The Higher Order Crack Tip Fields for Anti-Plane Crack in Functionally Graded Piezoelectric Materials

2014 ◽  
Vol 472 ◽  
pp. 617-620 ◽  
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Shi Min Li
Keyword(s):  
Material Properties ◽  
Piezoelectric Materials ◽  
Crack Problem ◽  
Functionally Graded ◽  
Plane Crack ◽  
Homogeneous Material ◽  
Plane Shear ◽  
Functionally Graded Piezoelectric Materials ◽  
Fundamental Significance ◽  
Functionally Graded Piezoelectric

The anti-plane crack problem is studied in functionally graded piezoelectric materials (FGPMs). The material properties of the FGPMs are assumed to be the exponential function of y. The crack is electrically impermeable and loaded by anti-plane shear tractions and in-plane electric displacements. Similar to the Williams solution of homogeneous material, the high order asymptotic fields are obtained by the method of asymptotic expansion. This investigation possesses fundamental significance as Williams solution.

The Higher Order Crack-Tip Fields for Anti-Plane Crack in Exponential Functionally Graded Piezoelectric Materials

2014 ◽  
Vol 989-994 ◽  
pp. 1212-1215
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Shi Min Li
Keyword(s):  
Piezoelectric Materials ◽  
Electric Displacement ◽  
Crack Tip ◽  
Expansion Method ◽  
Elastic Stiffness ◽  
Functionally Graded ◽  
Plane Crack ◽  
Displacement Fields ◽  
Functionally Graded Piezoelectric Materials ◽  
Functionally Graded Piezoelectric

The near-tip fields of an anti-plane crack in functionally graded piezoelectric materials (FGPMs) are investigated. To make the analysis tractable as usual, the elastic stiffness, piezoelectric parameter, and dielectric permittivity of FGPMs are assumed to be exponential functions of x parallel to the crack. The boundary conditions on crack surfaces are assumed to be the stress free and electrically impermeable. The high order crack tip stress and electric displacement fields are obtained by the eigen-expansion method. This study possesses fundamental significance as Williams’ solution to homogeneous materials.

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