Transient Response of a Hollow Functionally Graded Piezoelectric Cylinder Subjected to Coupled Hygrothermal Loading

In this paper, transient response of a simply supported finite length hollow cylinder made of functionally graded piezoelectric material (FGPM) subjected to coupled hygrothermal loading was investigated. The coupled equations of heat conduction and moisture diffusion as well as motion equations and the electrostatic equation of FGPM were solved employing the Fourier series expansion method through the longitudinal direction, the differential quadrature method (DQM) along the radius and Newmark method for time domain. Finally, the distribution of temperature, humidity, electric potential, stresses and displacements was achieved. The effect of coupled and uncoupled hygrothermal loading, grading index and hygrothermal loading was illustrated in the numerical examples. The results show that using the coupled model is vital for analysis of transient response of the cylinder subjected to hygrothermal loading.

Modified strain gradient theory for nonlinear vibration analysis of functionally graded piezoelectric doubly curved microshells

Based on modified strain gradient theory, nonlinear vibration analysis of a functionally graded piezoelectric doubly curved microshell in thermal environment has been performed in this research. Three scale parameters have been included in the modeling of thin doubly curved microshell in order to capture micro-size effects. Graded material properties between the top and bottom surfaces of functionally graded piezoelectric doubly curved microshell have been considered via incorporating power-law model. It is also assumed that the microshell is exposed to a temperature field of uniform type and the material properties are temperature-dependent. By analytically solving the governing equations based on the harmonic balance method, the closed form of nonlinear vibration frequency has been achieved. Obtained results indicate the relevance of calculated frequencies to three scale parameters, material gradation, electrical voltage, curvature radius, and temperature changes.