A staggered finite element procedure for the coupled Stokes-Biot system with fluid entry resistance

2020 ◽  
Vol 24 (4) ◽  
pp. 1497-1522 ◽  
Author(s):  
E. A. Bergkamp ◽  
C. V. Verhoosel ◽  
J. J. C. Remmers ◽  
D. M. J. Smeulders
Keyword(s):  
Finite Element ◽  
Finite Element Procedure ◽  
Biot System

Analysis of Deformation for PC Thin-Wall Box Girders Exposed to Fire

2011 ◽  
Vol 368-373 ◽  
pp. 930-933
Author(s):  
Wei Hou ◽  
Shuan Hai He ◽  
Cui Juan Wang ◽  
Gang Zhang
Keyword(s):  
Finite Element ◽  
Thin Wall ◽  
Fire Load ◽  
Box Girders ◽  
Conduction Model ◽  
Load Model ◽  
Deformation Problem ◽  
Finite Element Procedure ◽  
Thin Walled

Being aimed to deformation problem of pre-stressed concrete thin-walled multi-room box girders exposed to co-action of fire and load, on the basis of enthalpy conduction model and thermo-mechanics parameters, the finite element procedure was applied to analyze the deformation of three spans pre-stressed concrete thin-walled multi-room box girders exposed to co-action of fire and load. In conclusion, the deflection is obvious under action of the variation width and fire load model.

A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

1998 ◽  
Vol 120 (1) ◽  
pp. 24-34 ◽  
Author(s):  
C. Fu ◽  
D. L. McDowell ◽  
I. C. Ume
Keyword(s):  
Finite Element ◽  
Electronic Packaging ◽  
Copper Interconnects ◽  
Implicit Time ◽  
Integration Scheme ◽  
Single Element ◽  
Ofhc Copper ◽  
Computation Efficiency ◽  
Backward Euler ◽  
Finite Element Procedure

A finite element procedure using a semi-implicit time-integration scheme has been developed for a cyclic thermoviscoplastic constitutive model for Pb-Sn solder and OFHC copper, two common metallic constituents in electronic packaging applications. The scheme has been implemented in the commercial finite element (FE) code ABAQUS (1995) via the user-defined material subroutine, UMAT. Several single-element simulations are conducted to compare with previous test results, which include monotonic tensile tests, creep tests, and a two-step ratchetting test for 62Sn36Pb2Ag solder; a nonproportional axial-torsional test and a thermomechanical fatigue (TMF) test for OFHC copper. At the constitutive level, we also provide an adaptive time stepping algorithm, which can be used to improve the overall computation efficiency and accuracy especially in large-scale FE analyses. We also compare the computational efforts of fully backward Euler and the proposed methods. The implementation of the FE procedure provides a guideline to apply user-defined material constitutive relations in FE analyses and to perform more sophisticated thermomechanical simulations. Such work can facilitate enhanced understanding thermomechanical reliability issue of solder and copper interconnects in electronic packaging applications.

scholarly journals CRACK RESISTANCE OF BABBIT B83

2017 ◽  
Vol 2017 (1) ◽  
pp. 91-102 ◽  
Author(s):  
Михаил Зернин ◽  
Mikhail Zernin
Keyword(s):  
Finite Element ◽  
Stress Intensity ◽  
Crack Resistance ◽  
Stress Intensity Factors ◽  
Cyclic Crack Resistance ◽  
Intensity Factors ◽  
Finite Element Procedure ◽  
Crack Resistance Test ◽  
Definition Of ◽  
Fracture Viscosity

Babbit 83 crack resistance test in accordance with SSR 25-506-85 was carried out. By finite element method there were defined values of stress intensity factors in flat samples with a grown crack. The fracture viscosity characteristics of babbit are obtained. On the basis of a macro-fractographic analysis of wear fractures of a babbit sample and a finite element procedure for the definition of values of stress intensity factors the cha-racteristics of cyclic crack resistance are obtained. It is shown that a final fracture is realized at 3 МПа , and a transition from an elastic stage to the stage elastoplastic development of a crack is realized at 2,0…2,8 МПа .

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