scholarly journals Creep behavior of eutectic Sn-Cu lead-free solder alloy

2002 ◽  
Vol 31 (7) ◽  
pp. 828-828 ◽  
Author(s):  
C. M. L. Wu ◽  
M. L. Huang
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Creep behavior of eutectic Sn-Cu lead-free solder alloy

2002 ◽  
Vol 31 (5) ◽  
pp. 442-448 ◽  
Author(s):  
C. M. L. Wu ◽  
M. L. Huang
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder

Enhancement of solder properties of Sn-9Zn lead-free solder alloy

2006 ◽  
Vol 41 (12) ◽  
pp. 1210-1213 ◽  
Author(s):  
M. Kamal ◽  
E. S. Gouda
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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