2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
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308

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5

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Published By IEEE

9781424481408

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of glass transition slope of underfill on solder joint fatigue life

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582348 ◽

2010 ◽

Author(s):

Zhen Zhang ◽

S.B. Park ◽

Krishna Darbha ◽

Raj N. Master

Keyword(s):

Glass Transition ◽

Fatigue Life ◽

Solder Joint ◽

Solder Joint Fatigue

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Orientation relationships among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the eutectic SnBi/(111)Cu solder joint

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582454 ◽

2010 ◽

Author(s):

Pan-Ju Shang ◽

Zhi-Quan Liu ◽

Douxing Li ◽

Jian-Ku Shang

Keyword(s):

Solder Joint ◽

Orientation Relationships

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The research and application of the method of life consumption monitoring based on physics of failure

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582711 ◽

2010 ◽

Author(s):

Fan Li ◽

Michael Pecht ◽

Daniel Lau ◽

Gang Niu

Keyword(s):

Physics Of Failure ◽

Life Consumption

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Design of a compact antenna for Zigbee based on LTCC technology

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582851 ◽

2010 ◽

Author(s):

Su Hanzhang ◽

Li Yuejin ◽

Xing Mengjiang

Keyword(s):

Compact Antenna

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Comparative study of interfacial reactions of high-Sn Pb-free solders on (001) Ni single crystal and on polycrystalline Ni

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582331 ◽

2010 ◽

Author(s):

Huan Liu ◽

Mingliang Huang ◽

Haitao Ma ◽

Yipeng Cui

Keyword(s):

Comparative Study ◽

Single Crystal ◽

Interfacial Reactions

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Burn-in Screening Technology of Power Bare Die

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582780 ◽

2010 ◽

Author(s):

Huang Yun ◽

Yang Shaohua ◽

En Yunfei ◽

Feng Yongjie

Keyword(s):

Screening Technology

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Multi-scale modeling of moisture transfer in electronic packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582708 ◽

2010 ◽

Author(s):

H. B. Fan ◽

Matthew M.F. Yuen

Keyword(s):

Electronic Packaging ◽

Moisture Transfer ◽

Multi Scale ◽

Scale Modeling ◽

Multi Scale Modeling

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Thermal stress characteristics of Cu interconnects using Air-Gap

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582351 ◽

2010 ◽

Author(s):

Xiao-ling Lin ◽

Tong-xian Hou ◽

Zhang Xiao-wen ◽

Ruo-he Yao

Keyword(s):

Thermal Stress ◽

Air Gap ◽

Cu Interconnects

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Effect of tightening torque on the frequency of the sandwich piezoelectric ceramic transducer vibrator

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582398 ◽

2010 ◽

Author(s):

Jiaping Qiao ◽

Fuliang Wang

Keyword(s):

Piezoelectric Ceramic ◽

Tightening Torque ◽

Piezoelectric Ceramic Transducer ◽

Ceramic Transducer

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Wafer Level Camera technology - from wafer level packaging to wafer level integration

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582473 ◽

2010 ◽

Author(s):

Hongtao Han ◽

Moshe Kriman ◽

Mark Boomgarden

Keyword(s):

Wafer Level ◽

Wafer Level Packaging

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