2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications

TOTAL DOCUMENTS

308

(FIVE YEARS 0)

H-INDEX

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Published By IEEE

9781424481408

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Interpretation of ICA mechanical cycling data

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582752 ◽

2010 ◽

Cited By ~ 2

Author(s):

J. E. Morris ◽

Sini Niiranen ◽

Toni Mattila ◽

Jack McCarthy

Keyword(s):

Mechanical Cycling

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Design of a capacitive pressure sensor based on flip-chip packaging technology

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582678 ◽

2010 ◽

Author(s):

Meng Nie ◽

Qing-An Huang ◽

Ming Qin ◽

Wei-Hua Li

Keyword(s):

Pressure Sensor ◽

Flip Chip ◽

Capacitive Pressure Sensor ◽

Packaging Technology ◽

Flip Chip Packaging

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Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5583796 ◽

2010 ◽

Cited By ~ 1

Author(s):

Baomin Wang ◽

Liangliang Li

Keyword(s):

Numerical Simulation ◽

Transmission Lines ◽

Noise Suppression ◽

Magnetic Film ◽

Suppression Effect

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A miniaturized multi-layer lowpass filter for microwave application

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582410 ◽

2010 ◽

Cited By ~ 1

Author(s):

Zhao Yingbo ◽

Li Yuejin ◽

Xing Mengjiang

Keyword(s):

Lowpass Filter ◽

Microwave Application

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Pad finish related board-level solder joint reliability research

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582714 ◽

2010 ◽

Author(s):

Chen Zhengrong ◽

Zhou Jianwei ◽

Fu Xingming ◽

Lee Jaisung

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Board Level

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Design of band-pass filter on different materials in LTCC/LTCF technology

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582701 ◽

2010 ◽

Author(s):

Bing Bai ◽

Yintang Yang ◽

Yuejin Li

Keyword(s):

Band Pass Filter ◽

Pass Filter ◽

Band Pass

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Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582406 ◽

2010 ◽

Cited By ~ 1

Author(s):

Liqiang ◽

Alan Mathewson ◽

Brendan O'Flynn ◽

Michael Hayes ◽

Cian O'Mathuna

Keyword(s):

Statistical Method ◽

Sensor Nodes ◽

Wireless Sensor ◽

Wireless Sensor Nodes ◽

Modeling And Optimization

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MDS study on the adhesive heat transfer in micro-channel cooler

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5583859 ◽

2010 ◽

Cited By ~ 2

Author(s):

Shun Wang ◽

Yan Zhang ◽

Zhili Hu ◽

Johan Liu

Keyword(s):

Heat Transfer ◽

Micro Channel

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Mechanical characterization of the IMC layer by using Nano-indentation tests

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582726 ◽

2010 ◽

Cited By ~ 1

Author(s):

Yuan Guozheng ◽

Li Zhigang ◽

Shu Xuefeng

Keyword(s):

Mechanical Characterization ◽

Nano Indentation ◽

Indentation Tests

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Author index

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582387 ◽

2010 ◽

Download Full-text

2010 11th International Conference on Electronic Packaging Technology & High Density PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Interpretation of ICA mechanical cycling data

Design of a capacitive pressure sensor based on flip-chip packaging technology

Numerical simulation on the noise suppression effect of nanogranular magnetic film CoFeHfO on PCB transmission lines

A miniaturized multi-layer lowpass filter for microwave application

Pad finish related board-level solder joint reliability research

Design of band-pass filter on different materials in LTCC/LTCF technology

Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates

MDS study on the adhesive heat transfer in micro-channel cooler

Mechanical characterization of the IMC layer by using Nano-indentation tests

Author index

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications