2006 7th International Conference on Electronic Packaging Technology
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177
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Published By IEEE

1424406196, 142440620x
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The Characterization of Intermetallic Growth in Copper and Gold Ball Bonded on Thicker Aluminum

2006 ◽  
Author(s):  
Liangyi Hung ◽  
Yuwei Lin ◽  
Simon Chen ◽  
Yupo Wang ◽  
C. S. Hsiao
Keyword(s):  
Intermetallic Growth ◽  
Gold Ball

Machine Vision Recognition of Disconnection Failure of IC Wafer

2006 ◽  
Author(s):  
Guitang Wang ◽  
Dongdong Li ◽  
Liming Wu ◽  
Yaohua Deng ◽  
Runyu Liu
Keyword(s):  
Machine Vision

Modelling of Thermodynamic, Thermophysical and Physical Properties of Lead-Free Solder Alloys

2006 ◽  
Author(s):  
Zhanli Guo ◽  
Nigel Saunders ◽  
Peter Miodownik ◽  
Jean-Philippe Schille
Keyword(s):  
Physical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Fabrication of Hermetic Cell Using MEMS Technology

2006 ◽  
Author(s):  
Tingkai Zhang ◽  
Zhiyin Gan ◽  
Xinyi Zhao ◽  
Honghai Zhang ◽  
Sheng Liu
Keyword(s):  
Mems Technology
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