2006 7th International Conference on Electronic Packaging Technology
Latest Publications

TOTAL DOCUMENTS

177

(FIVE YEARS 0)

H-INDEX

8

(FIVE YEARS 0)

Published By IEEE

1424406196, 142440620x

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Fabrication of Hermetic Cell Using MEMS Technology

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359834 ◽

2006 ◽

Author(s):

Tingkai Zhang ◽

Zhiyin Gan ◽

Xinyi Zhao ◽

Honghai Zhang ◽

Sheng Liu

Keyword(s):

Mems Technology

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Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359738 ◽

2006 ◽

Author(s):

Xiaosong Ma ◽

K.M.B. Jansen ◽

G.Q. Zhang ◽

L.J. Ernst

Keyword(s):

Moisture Absorption ◽

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Room/Low Temperature Interconnection Technique on Micro-bump/Film for COC and COF System

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359874 ◽

2006 ◽

Author(s):

Zhonghua Xu ◽

Tadatomo Suga

Keyword(s):

Low Temperature

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Study on Optimized Processing Parameters and Joint Resistance of Device during Ultrasonic Bonding

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359757 ◽

2006 ◽

Author(s):

Mingyu Li ◽

Jingwei Guan ◽

Hongjun Ji

Keyword(s):

Processing Parameters ◽

Ultrasonic Bonding ◽

Joint Resistance

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Machine Vision Recognition of Disconnection Failure of IC Wafer

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359658 ◽

2006 ◽

Author(s):

Guitang Wang ◽

Dongdong Li ◽

Liming Wu ◽

Yaohua Deng ◽

Runyu Liu

Keyword(s):

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Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359753 ◽

2006 ◽

Author(s):

Jia Wang ◽

Bing An ◽

Jingqiang He ◽

Fengshun Wu ◽

Yiping Wu

Keyword(s):

Electroless Nickel ◽

Electroless Nickel Plating ◽

Nickel Plating ◽

Polystyrene Microsphere ◽

Conductive Particles

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Modelling of Thermodynamic, Thermophysical and Physical Properties of Lead-Free Solder Alloys

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359815 ◽

2006 ◽

Author(s):

Zhanli Guo ◽

Nigel Saunders ◽

Peter Miodownik ◽

Jean-Philippe Schille

Keyword(s):

Physical Properties ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

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The Characterization of Intermetallic Growth in Copper and Gold Ball Bonded on Thicker Aluminum

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359867 ◽

2006 ◽

Author(s):

Liangyi Hung ◽

Yuwei Lin ◽

Simon Chen ◽

Yupo Wang ◽

C. S. Hsiao

Keyword(s):

Intermetallic Growth ◽

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Heat Spreader with Aligned CNTs Designed for Thermal Management of HB-LED Packaging and Microelectronic Packaging

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359779 ◽

2006 ◽

Author(s):

Kai Zhang ◽

Matthew M. F. Yuen

Keyword(s):

Thermal Management ◽

Microelectronic Packaging ◽

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Study on the Low-looped Ability of Forward and Reverse Looping Methods of Gold Wire Ball Bonding for Stacked Die Package Application

2006 7th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2006.359871 ◽

2006 ◽

Author(s):

Xiu-Lan Cheng ◽

Yu-Cai Huang

Keyword(s):

Gold Wire ◽

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