Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements
1999 ◽
Vol 28
(11)
◽
pp. 1184-1188
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2015 ◽
Vol 67
◽
pp. 217-223
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Keyword(s):
2013 ◽
Vol 45
◽
pp. 300-307
◽
2012 ◽
Vol 52
(12)
◽
pp. 2210-2219
◽
Effect of aging temperature on microstructure and mechanical properties of Sn–9Zn–xZrC solder joints
2018 ◽
Vol 30
(1)
◽
pp. 753-759
◽
2012 ◽
Vol 182-183
◽
pp. 162-166
2020 ◽
Vol 31
(24)
◽
pp. 22810-22819
2012 ◽
Vol 32
(16)
◽
pp. 4195-4204
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2017 ◽
Vol 49
(2)
◽
pp. 661-672
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