Thermal modeling and analysis of a power ball grid array in system-in-package technology

2021 ◽  
Author(s):  
Alberto Bocca ◽  
Alberto Macii
Keyword(s):  
Thermal Modeling ◽  
Ball Grid Array ◽  
Modeling And Analysis

Analysis and Temperature Control of Hybrid Microcircuits

1973 ◽  
Vol 95 (4) ◽  
pp. 1048-1052 ◽  
Author(s):  
J. T. Pogson ◽  
J. L. Franklin
Keyword(s):  
Temperature Control ◽  
Thermal Modeling ◽  
Preliminary Design ◽  
Temperature Profiles ◽  
Modeling And Analysis ◽  
Parametric Studies ◽  
Temperature Levels ◽  
Typical Component ◽  
Circuit Designer ◽  
Component Temperature

The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases.

scholarly journals Thermal modeling and analysis of 3D multi-processor chips

Integration ◽  
2010 ◽  
Vol 43 (4) ◽  
pp. 327-341 ◽  
Author(s):  
José L. Ayala ◽  
Arvind Sridhar ◽  
David Cuesta
Keyword(s):  
Thermal Modeling ◽  
Modeling And Analysis

scholarly journals Thermal modeling and analysis of advanced 3D stacked structures

2012 ◽  
Vol 30 ◽  
pp. 248-257 ◽  
Author(s):  
Kameswar Rao Vaddina ◽  
Amir-Mohammad Rahmani ◽  
Khalid Latif ◽  
Pasi Liljeberg ◽  
Juha Plosila
Keyword(s):  
Thermal Modeling ◽  
Modeling And Analysis
Sign in / Sign up

Export Citation Format

Share Document