2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Thermal Digital Innovation in the DfSS - DIDOV Framework

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923597 ◽

2019 ◽

Author(s):

Wendy Luiten

Keyword(s):

Digital Innovation

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Efficient Computational Methodology of Thermo-Mechanical Phenomena in the Metal System of Power ICs

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923502 ◽

2019 ◽

Cited By ~ 1

Author(s):

Adrian Bojita ◽

Marius Purcar ◽

Cristian Boianceanu ◽

Vasile Topa

Keyword(s):

Metal System ◽

Computational Methodology ◽

Mechanical Phenomena

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Pin Fin Heat Sink Optimization for Natural-Convection Cooling

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923620 ◽

2019 ◽

Author(s):

Wessel W. Wits ◽

Yannick Jeggels ◽

Norbert Engelberts

Keyword(s):

Natural Convection ◽

Heat Sink ◽

Pin Fin ◽

Convection Cooling ◽

Heat Sink Optimization

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Investigation on Thermo-Physical Properties of 500 nm CVD Grown Tungsten Layers using Time Domain Thermoreflectance and Scanning Thermal Microscopy

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923439 ◽

2019 ◽

Author(s):

Katrin Fladischer ◽

Lisa Mitterhuber ◽

Verena Leitgeb ◽

Stefan Defregger ◽

Jurgen Spitaler

Keyword(s):

Physical Properties ◽

Time Domain ◽

Scanning Thermal Microscopy ◽

Thermal Microscopy ◽

Thermo Physical Properties

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Thermal Investigation of AlGaN-GaN Multilayer Structures

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923823 ◽

2019 ◽

Cited By ~ 1

Author(s):

Lisa Mitterhuber ◽

Rene Hammer ◽

Thomas Dengg ◽

Katrin Fladischer ◽

Jurgen Spitaler

Keyword(s):

Multilayer Structures ◽

Thermal Investigation

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Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923865 ◽

2019 ◽

Author(s):

Konstantin O. Petrosyants ◽

Nikita I. Ryabov

Keyword(s):

Thermal Model ◽

Bga Package

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Thermal Resistance and Impedance Calculator (TRIC)

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923605 ◽

2019 ◽

Cited By ~ 1

Author(s):

Lorenzo Codecasa ◽

Francesca De Viti ◽

Salvatore Race ◽

Vincenzo d'Alessandro ◽

Donata Gualandris ◽

...

Keyword(s):

Thermal Resistance

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Thermal Modeling of a Power Ball Grid Array in System-in-Package Configuration

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923577 ◽

2019 ◽

Author(s):

Alberto Bocca ◽

Giovanni Graziosi ◽

Alberto Macii

Keyword(s):

Thermal Modeling ◽

Ball Grid Array

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Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923562 ◽

2019 ◽

Cited By ~ 1

Author(s):

Justin Broughton ◽

Yogendra Joshi

Keyword(s):

Power Electronics ◽

Thermal Management ◽

Metal Foams ◽

Open Cell

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Modelling of 3D Temperature Behavior of Prismatic Lithium-Ion Cell With Focus on Experimental Validation Under Battery Electric Vehicle Conditions

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2019.8923604 ◽

2019 ◽

Author(s):

Jan Kleiner ◽

Lidiya Komsiyska ◽

Gordon Elger ◽

Christian Endisch

Keyword(s):

Electric Vehicle ◽

Experimental Validation ◽

Lithium Ion ◽

Temperature Behavior ◽

Battery Electric Vehicle ◽

Lithium Ion Cell

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2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal Digital Innovation in the DfSS - DIDOV Framework

Efficient Computational Methodology of Thermo-Mechanical Phenomena in the Metal System of Power ICs

Pin Fin Heat Sink Optimization for Natural-Convection Cooling

Investigation on Thermo-Physical Properties of 500 nm CVD Grown Tungsten Layers using Time Domain Thermoreflectance and Scanning Thermal Microscopy

Thermal Investigation of AlGaN-GaN Multilayer Structures

Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package

Thermal Resistance and Impedance Calculator (TRIC)

Thermal Modeling of a Power Ball Grid Array in System-in-Package Configuration

Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams

Modelling of 3D Temperature Behavior of Prismatic Lithium-Ion Cell With Focus on Experimental Validation Under Battery Electric Vehicle Conditions

Export Citation Format

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal Digital Innovation in the DfSS - DIDOV Framework

Efficient Computational Methodology of Thermo-Mechanical Phenomena in the Metal System of Power ICs

Pin Fin Heat Sink Optimization for Natural-Convection Cooling

Investigation on Thermo-Physical Properties of 500 nm CVD Grown Tungsten Layers using Time Domain Thermoreflectance and Scanning Thermal Microscopy

Thermal Investigation of AlGaN-GaN Multilayer Structures

Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package

Thermal Resistance and Impedance Calculator (TRIC)

Thermal Modeling of a Power Ball Grid Array in System-in-Package Configuration

Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams

Modelling of 3D Temperature Behavior of Prismatic Lithium-Ion Cell With Focus on Experimental Validation Under Battery Electric Vehicle Conditions

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications