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2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications
TOTAL DOCUMENTS
69
(FIVE YEARS 69)
H-INDEX
2
(FIVE YEARS 2)
Published By IEEE
9781728120782
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Efficient Computational Methodology of Thermo-Mechanical Phenomena in the Metal System of Power ICs
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923502
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2019
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Cited By ~ 1
Author(s):
Adrian Bojita
◽
Marius Purcar
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Cristian Boianceanu
◽
Vasile Topa
Keyword(s):
Metal System
◽
Computational Methodology
◽
Mechanical Phenomena
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Pin Fin Heat Sink Optimization for Natural-Convection Cooling
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923620
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2019
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Author(s):
Wessel W. Wits
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Yannick Jeggels
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Norbert Engelberts
Keyword(s):
Natural Convection
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Heat Sink
◽
Pin Fin
◽
Convection Cooling
◽
Heat Sink Optimization
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Investigation on Thermo-Physical Properties of 500 nm CVD Grown Tungsten Layers using Time Domain Thermoreflectance and Scanning Thermal Microscopy
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923439
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2019
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Author(s):
Katrin Fladischer
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Lisa Mitterhuber
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Verena Leitgeb
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Stefan Defregger
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Jurgen Spitaler
Keyword(s):
Physical Properties
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Time Domain
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Scanning Thermal Microscopy
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Thermal Microscopy
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Thermo Physical Properties
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Thermal Investigation of AlGaN-GaN Multilayer Structures
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923823
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2019
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Cited By ~ 1
Author(s):
Lisa Mitterhuber
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Rene Hammer
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Thomas Dengg
◽
Katrin Fladischer
◽
Jurgen Spitaler
Keyword(s):
Multilayer Structures
◽
Thermal Investigation
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Quasi-3D Thermal Model of Stacked IC-TSV-BGA Package
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923865
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2019
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Author(s):
Konstantin O. Petrosyants
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Nikita I. Ryabov
Keyword(s):
Thermal Model
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Bga Package
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Thermal Resistance and Impedance Calculator (TRIC)
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923605
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2019
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Cited By ~ 1
Author(s):
Lorenzo Codecasa
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Francesca De Viti
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Salvatore Race
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Vincenzo d'Alessandro
◽
Donata Gualandris
◽
...
Keyword(s):
Thermal Resistance
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Thermal Modeling of a Power Ball Grid Array in System-in-Package Configuration
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923577
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2019
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Author(s):
Alberto Bocca
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Giovanni Graziosi
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Alberto Macii
Keyword(s):
Thermal Modeling
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Ball Grid Array
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Thermal Management of Power Electronics Using Stochastic, Open-Cell Metal Foams
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923562
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2019
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Cited By ~ 1
Author(s):
Justin Broughton
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Yogendra Joshi
Keyword(s):
Power Electronics
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Thermal Management
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Metal Foams
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Open Cell
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Modelling of 3D Temperature Behavior of Prismatic Lithium-Ion Cell With Focus on Experimental Validation Under Battery Electric Vehicle Conditions
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923604
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2019
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Author(s):
Jan Kleiner
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Lidiya Komsiyska
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Gordon Elger
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Christian Endisch
Keyword(s):
Electric Vehicle
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Experimental Validation
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Lithium Ion
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Temperature Behavior
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Battery Electric Vehicle
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Lithium Ion Cell
Download Full-text
Fully-Coupled Electrothermal Simulation of Wide-Area Reverse Conducting IGBTs
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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10.1109/therminic.2019.8923497
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2019
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Author(s):
Michele Riccio
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Alessandro Borghese
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Luca Maresca
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Giovanni Breglio
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Andrea Irace
Keyword(s):
Wide Area
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Electrothermal Simulation
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Fully Coupled
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