High temperature-room temperature deformation behavior of MgCu2 laves phase intermetallic compound

1989 ◽  
Vol 37 (9) ◽  
pp. 2377-2384 ◽  
Author(s):  
Y. Ohba ◽  
N. Sakuma
2003 ◽  
Vol 11 (3) ◽  
pp. 257-267 ◽  
Author(s):  
Won-Yong Kim ◽  
David E Luzzi ◽  
David P Pope

2004 ◽  
Vol 449-452 ◽  
pp. 829-832
Author(s):  
Tae Kwon Ha ◽  
Jae Young Jung

High temperature deformation behavior of a Ti-Al intermetallic compound has been investigated in this study. Specimens with a near gamma and a lamella structure were obtained by performing heat treatment at temperatures from 1200 to 1330°C for 24 hr, respectively, and stabilized at 900°C for 4 hr followed by air cooling. A series of load relaxation tests has been conducted on these samples at temperatures ranging from 850 to 950°C to construct flow curves in the strain rate range from 10-6/s to 10-3/s. Strain hardening was observed even at the temperature of 950°C in both the near gamma and the lamella structures. Further aging treatment for 12 hr at the test temperatures has been found to cause negligible softening in both microstructures, providing the strong applicability of this alloy system in the temperature range.


2004 ◽  
Vol 449-452 ◽  
pp. 57-60
Author(s):  
I.G. Lee ◽  
A.K. Ghosh

In order to analyze high temperature deformation behavior of NiAl alloys, deformation maps were constructed for stoichiometric NiAl materials with grain sizes of 4 and 200 µm. Relevant constitute equations and calculation method will be described in this paper. These maps are particularly useful in identifying the location of testing domains, such as creep and tensile tests, in relation to the stress-temperature-strain rate domains experienced by NiAl.


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