Abnormal grain growth of Goss grains in Fe–3% Si steel driven by sub-boundary-enhanced solid-state wetting: Analysis by Monte Carlo simulation

2010 ◽  
Vol 58 (13) ◽  
pp. 4414-4423 ◽  
Author(s):  
Kyung-Jun Ko ◽  
Anthony D. Rollett ◽  
Nong-Moon Hwang
Keyword(s):  
Monte Carlo Simulation ◽  
Monte Carlo ◽  
Solid State ◽  
Grain Growth ◽  
Abnormal Grain Growth

Monte-Carlo Simulation of Goss Abnormal Grain Growth in Fe-3%Si Steel by Sub-Boundary Enhanced Solid-State Wetting

2012 ◽  
Vol 715-716 ◽  
pp. 146-151
Author(s):  
K.J. Ko ◽  
A.D. Rollett ◽  
N.M. Hwang
Keyword(s):  
Monte Carlo ◽  
Solid State ◽  
Grain Boundary ◽  
Grain Growth ◽  
Boundary Energy ◽  
Three Dimensional ◽  
Abnormal Grain Growth ◽  
Grain Boundary Energy ◽  
Simulation Based ◽  
Mc Simulation

The selective abnormal grain growth (AGG) of Goss grains in Fe-3%Si steel was investigated using a parallel Monte-Carlo (MC) simulation based on the new concept of sub-boundary enhanced solid-state wetting. Goss grains with low angle sub-boundaries will induce solid-state wetting against matrix grains with a moderate variation in grain boundary energy. Three-dimensional MC simulations of microstructure evolution with textures and grain boundary distributions matched to experimental data is using in this study.

Three Dimensional Monte Carlo Simulations with Real Grain Orientations for the Role of Sub-Boundaries and Precipitates in Abnormal Grain Growth

2013 ◽  
Vol 753 ◽  
pp. 367-372
Author(s):  
Tae Wook Na ◽  
Chang Soo Park ◽  
Hyung Seok Shim ◽  
Byeong Joo Lee ◽  
Chan Hee Han ◽  
...  
Keyword(s):  
Monte Carlo ◽  
Solid State ◽  
Monte Carlo Simulations ◽  
Grain Growth ◽  
Three Dimensional ◽  
Abnormal Grain Growth ◽  
Grain Orientations ◽  
The Matrix ◽  
Simulation Results

Three-dimensional Monte Carlo simulations with real grain orientations are performed to study the role of precipitates and sub-boundaries in the abnormal grain growth. According to the simulation results, sub-boundaries in the abnormally growing grain and precipitates in the matrix grains are necessary for the abnormal grain growth. The simulation results can be best explained by the mechanism of sub-boundary enhanced solid state wetting. The simulated microstructure is very similar to that experimentally observed.

scholarly journals Monte Carlo simulation of abnormal grain growth in two dimensions

2001 ◽  
Vol 308 (1-2) ◽  
pp. 258-267 ◽  
Author(s):  
René Messina ◽  
Michèle Soucail ◽  
Ladislas Kubin
Keyword(s):  
Monte Carlo Simulation ◽  
Monte Carlo ◽  
Grain Growth ◽  
Two Dimensions ◽  
Abnormal Grain Growth

Three-dimensional Monte Carlo simulation for the effect of precipitates and sub-boundaries on abnormal grain growth

2012 ◽  
Vol 66 (6) ◽  
pp. 398-401 ◽  
Author(s):  
Chang-Soo Park ◽  
Tae-Wook Na ◽  
Hyung-Ki Park ◽  
Byeong-Joo Lee ◽  
Chan-Hee Han ◽  
...  
Keyword(s):  
Monte Carlo Simulation ◽  
Monte Carlo ◽  
Grain Growth ◽  
Three Dimensional ◽  
Abnormal Grain Growth

scholarly journals Monte Carlo simulation of grain growth

1999 ◽  
Vol 2 (3) ◽  
pp. 133-137 ◽  
Author(s):  
Paulo Blikstein ◽  
André Paulo Tschiptschin
Keyword(s):  
Monte Carlo Simulation ◽  
Monte Carlo ◽  
Grain Growth

Sensitivity Analysis on Solder Joint Fatigue Life of Solid State Drives by Finite Element Method and Monte Carlo Simulation

2017 ◽  
Author(s):  
Y. J. Cho ◽  
J. W. Jang ◽  
G. H. Jang
Keyword(s):  
Finite Element Method ◽  
Monte Carlo Simulation ◽  
Finite Element ◽  
Monte Carlo ◽  
Fatigue Life ◽  
Solid State ◽  
Thermal Cycling ◽  
Solder Ball ◽  
Solid State Drives ◽  
Element Method

We proposed a method to estimate a distribution of fatigue life of solid state drives (SSDs) due to thermal cycling excitation by using finite element method and Monte Carlo simulation. In the developed finite element model, we utilized the Anand model to represent the viscoplastic behavior of the solder balls, and we also utilized the Prony series to represent the viscoelastic behavior of the polymer material in underfill. We determined a fatigue life of the SSD by using the Morrow’s energy-based fatigue model. Finally, we determined a distribution of fatigue life considering the manufacturing tolerance of the design variables and the variation of material properties in the Monte Carlo simulation. Finite element analysis shows that the outermost solder ball at the corner of dynamic random access memory was the most vulnerable component under the thermal cycling excitation. We also show that temperature profile and diameter of solder ball affect dominantly the fatigue life of the SSD.

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