Mechanical Property Improvement in Dissimilar Friction Stir Welded Al5083/Al6061 Joints: Effects of Post-Weld Heat Treatment and Abnormal Grain Growth

The 5083 and 6061(T6) aluminum (Al) alloys are widely used in transportation industries and the development of structural designs because of their high toughness and high corrosion resistance. Friction stir welding (FSW) was performed to produce the dissimilar welded joint of Al5083-Al 6061(T6) under different welding parameters. However, softening behavior occurred in the friction stir welded (FSWed) samples because of grain coarsening or the dissolution of precipitation-hardening phases in the welding zone. Consequently, this research intended to investigate the effect of the post-weld heat treatment (PWHT) method on the mechanical property improvement of the dissimilar FSWed Al5083-Al6061(T6) and governing abnormal grain growth (AGG) through different welding parameters. The results showed PWHT enhanced the mechanical properties of dissimilar joints of Al5083-Al6061(T6). AGG was obtained in the microstructure of PWHTed joints, but appropriate PWHT could recover the dissolved precipitation-hardening particle in the heat-affected zone of the as-welded joint. Further, the tensile strength of the dissimilar joint increased from 181 MPa in the as-welded joint to 270 MPa in the PWHTed joint, showing 93% welding efficacy.

The Effect of Ethanol on Abnormal Grain Growth in Copper Foils

Single-crystal Cu not only has high electrical and thermal conductivity, but can also be used as a promising platform for the epitaxial growth of two-dimensional materials. Preparing large-area single-crystal Cu foils from polycrystalline foils has emerged as the most promising technique in terms of its simplicity and effectiveness. However, the studies on transforming polycrystalline foil into large-area single-crystal foil mainly focus on the influence of annealing temperature and strain energy on the recrystallization process of copper foil, while studies on the effect of annealing atmosphere on abnormal grain growth behavior are relatively rare. It is necessary to carry out more studies on the effect of annealing atmosphere on grain growth behavior to understand the recrystallization mechanism of metal. Here, we found that introduction of ethanol in pure argon annealing atmosphere will cause the abnormal grain growth of copper foil. Moreover, the number of abnormally grown grains can be controlled by the concentration of ethanol in the annealing atmosphere. Using this technology, the number of abnormally grown grains on the copper foil can be controlled to single one. This abnormally grown grain will grow rapidly to decimeter-size by consuming the surrounding small grains. This work provides a new perspective for the understanding of the recrystallization of metals, and a new method for the preparation of large-area single-crystal copper foils.

Modeling of abnormal grain growth in (111) oriented and nanotwinned copper

Uni-modal, not bi-modal, of abnormal grain growth has been observed in (111) oriented and nano-twinned Cu films. Because of the highly anisotropic microstructure, our kinetic analysis and calculation showed that it is the mobility which dominates the uni-modal growth, in which the lateral growth rate can be two orders of magnitude higher than the vertical growth rate. As a consequence, the abnormal grain growth has been converted from bi-modal to uni-modal.