Reprint of “Control of pool boiling incipience in confined space: Dynamic morphing of the wall effect”

2013 ◽  
Vol 59 (1-2) ◽  
pp. 696-703
Author(s):  
L. Leal ◽  
P. Lavieille ◽  
M. Miscevic ◽  
F. Pigache ◽  
L. Tadrist
2013 ◽  
Vol 51 (1-2) ◽  
pp. 451-458 ◽  
Author(s):  
L. Leal ◽  
P. Lavieille ◽  
M. Miscevic ◽  
F. Pigache ◽  
L. Tadrist

2017 ◽  
Vol 118 ◽  
pp. 188-198 ◽  
Author(s):  
Yongsheng Tian ◽  
Keyuan Zhang ◽  
Naihua Wang ◽  
Zheng Cui ◽  
Lin Cheng

1992 ◽  
Vol 117 (1) ◽  
pp. 205-217 ◽  
Author(s):  
MAW TIEN LEE ◽  
YU MIN YANG ◽  
JER RU MAA

1995 ◽  
Vol 117 (3) ◽  
pp. 687-692 ◽  
Author(s):  
S. M. You ◽  
T. W. Simon ◽  
A. Bar-Cohen ◽  
Y. S. Hong

Experimental results on pool boiling heat transfer from a horizontal cylinder in an electronic cooling fluid (FC-72) are presented. The effects on the boiling curve of having air dissolved in the fluid are documented, showing that fluid in the vicinity of the heating element is apparently liberated of dissolved gas during boiling. Dissolved gas was found to influence boiling incipience only with high gas concentrations (>0.005 moles/mole). For low-to-moderate concentrations, a larger superheat is required to initiate boiling and a hysteresis is observed between boiling curves taken with increasing and decreasing heat flux steps. Boiling, a very effective mode of heat transfer, is attractive for electronics cooling. The present experiment provides further documentation of the role of dissolved gas on the incipience process and shows similarities with subcooled boiling of a gas-free fluid.


1995 ◽  
Author(s):  
Maninder Sehmbey ◽  
Louis Chow ◽  
Ottfried Hahn ◽  
Charlotte Chui

2018 ◽  
Vol 122 ◽  
pp. 1239-1254 ◽  
Author(s):  
Yongsheng Tian ◽  
Zengqiao Chen ◽  
Naihua Wang ◽  
Dan Zhou ◽  
Lin Cheng

Author(s):  
Mohamed S. El-Genk ◽  
Jack L. Parker

Experiments are conducted that investigated pool boiling of FC-72 liquid at saturation and 10, 20, and 30 K subcooling on porous graphite and smooth copper surfaces measuring 10 × 10 mm. The nucleate boiling heat flux, Critical Heat Flux (CHF), and surface superheats at boiling incipience are compared. Theses heat fluxes are also compared with those of other investigators for smooth copper and silicon, etched SiO2, surfaces and micro-porous coating. No temperature excursion at boiling incipience on the porous graphite that occurred at a surface superheats of < 1.0 K. Conversely, the temperature excursions of 24.0 K and 12.4–17.8 K are measured at incipient boiling in saturation and subcooled boiling on copper. Nucleate boiling heat fluxes on porous graphite are significantly higher and corresponding surface superheats are much smaller than on copper. CHF on porous graphite (27.3, 39.6, 49.0, and 57.1 W/cm2 in saturation and 10 K, 20 K, and 30 K subcooled boiling, respectively) are 61.5%–207% higher than those on copper (16.9, 19.5, 23.6, and 28.0 W/cm2, respectively). The surface superheats at CHF on the porous graphite of 11.5 K in saturation and 17–20 K in subcooled boiling are significantly lower that those on copper (25 K and 26–28 K, respectively). In addition, the rate of increase of CHF on porous graphite with increased subcooling is ~ 125% higher than that on copper.


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