Cell electroporation with a three-dimensional microelectrode array on a printed circuit board

2015 ◽  
Vol 102 ◽  
pp. 35-41 ◽  
Author(s):  
Youchun Xu ◽  
Shisheng Su ◽  
Changcheng Zhou ◽  
Ying Lu ◽  
Wanli Xing
Keyword(s):  
Microelectrode Array ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Circuit Board ◽  
Printed Circuit ◽  
Cell Electroporation

Three Dimensional Detection of the via in the PCB CT Image Using Morphology Operation

2015 ◽  
Vol 752-753 ◽  
pp. 1406-1412
Author(s):  
Lei Zeng ◽  
Jian Chen ◽  
Han Ning Li ◽  
Bin Yan ◽  
Yi Fu Xu ◽  
...  
Keyword(s):  
Nondestructive Testing ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Detection Algorithm ◽  
Circuit Board ◽  
Dimensional Structure ◽  
Three Dimension ◽  
Shape Information ◽  
Printed Circuit ◽  
Testing Technology

In modern industry, the nondestructive testing of printed circuit board (PCB) can prevent effectively the system failure and is becoming more and more important. As a vital part of the PCB, the via connects the devices, the components and the wires and plays a very important role for the connection of the circuits. With the development of testing technology, the nondestructive testing of the via extends from two dimension to three dimension in recent years. This paper proposes a three dimensional detection algorithm using morphology method to test the via. The proposed algorithm takes full advantage of the three dimensional structure and shape information of the via. We have used the proposed method to detect via from PCB images with different size and quality, and found the detection performances to be very encouraging.

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Circuit Board ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Conduction Model ◽  
Printed Circuit

We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

scholarly journals TECHNOLOGY FOR CREATING THE TOPOLOGY OF PRINTED CIRCUIT BOARDS USING POLYMER 3D MASKS

2021 ◽  
pp. 120-131
Author(s):  
Igor Nevliudov ◽  
Evgeny Razumov-Fryzyuk ◽  
Dmytro Nikitin ◽  
Danila Bliznyuk ◽  
Roman Strelets
Keyword(s):  
3D Printing ◽  
Regression Models ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Experimental Studies ◽  
Three Dimensional ◽  
Circuit Board ◽  
Work Piece ◽  
Circuit Boards ◽  
Printed Circuit

The subject of research is the influence of factors of exposure of two-dimensional images on the topology of conductors in the manufacture of printed circuit boards by the method of three-dimensional polymer photomasks. The purpose of the work is ensuring the accuracy and preservation of the geometric dimensions of the conductors of printed circuit boards during LCD exposure of masks on the work piece. To achieve this goal, it is necessary to solve the following tasks: to analyze photolithography technology and types of polymer 3D printing; to develop a technological process for exposing photopolymer masks to a printed circuit board blank using 3D printing technologies; to conduct experimental studies to determine the optimal exposure parameters; on the basis of the empirical results obtained, to calculate the correlation coefficients of the factors for recall; to construct a linear regression model of the dependence of the deviations of the geometric dimensions of the printed conductors on the parameters of solutions for etching and exposure conditions. Results: The constructed regression models will become the basis for creating a software database that optimizes the initial images of the topology of printed conductors in the automated production of printed circuit boards. This will simplify the process of developing the topology of printed circuit boards, taking into account the real influence of the parameters of the technological operations of etching and exposure on the thickness of the tracks of the conductors of the printed circuit boards, which will reduce the proportion of rejects in the manufacture of single- and double-sided printed circuit boards. Conclusions: an LCD exposure technology and a method for studying the effects of exposure factors on the quality of printed circuit board topology are proposed, which provide sufficient empirical data to create regression models for calculating the influence of technological factors on the final dimensions of conductive paths in the production of printed circuit boards. Further development of the proposed technology will make it possible to manufacture rigid and flexible printed circuit boards completely, with conductive paths, a dielectric base, electronic elements that can be used in various devices.

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