Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing

2010 ◽  
Vol 366 (1-3) ◽  
pp. 68-73 ◽  
Author(s):  
P.R. Veera Dandu ◽  
B.C. Peethala ◽  
Naresh K. Penta ◽  
S.V. Babu
Keyword(s):  
Amino Acids ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Removal Rates ◽  
Polysilicon Films

ChemInform Abstract: Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

ChemInform ◽  
2010 ◽  
Vol 29 (31) ◽  
pp. no-no
Author(s):  
C. GUI ◽  
M. ELWENSPOEK ◽  
J. G. E. GARDENIERS ◽  
P. V. LAMBECK
Keyword(s):  
Wafer Bonding ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Future Role

Chemical Mechanical Polishing of Al and SiO2 Thin Films: The Role of Consumables

1999 ◽  
Vol 146 (12) ◽  
pp. 4647-4653 ◽  
Author(s):  
J. Hernandez ◽  
P. Wrschka ◽  
Y. Hsu ◽  
T. ‐S. Kuan ◽  
G. S. Oehrlein ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing
Sign in / Sign up

Export Citation Format

Share Document