A gamma process model for the analysis of fatigue crack growth data

Some fatigue crack growth data have been obtained for age-hardened beryllium copper. The fatigue crack growth rate was found to be very dependent on the hardness and tensile mean stress. This dependence is believed to be associated with the intense residual stresses surrounding Preston-Guinier zones.

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Recording of Elevated Temperature Fatigue Crack Growth Data by DCPD System

High Temperature Materials and Processes ◽

10.1515/htmp.2000.19.5.357 ◽

2000 ◽

Vol 19 (5) ◽

pp. 357-370 ◽

Cited By ~ 1

Author(s):

N. Ramachandran, ◽

N. Arakere, ◽

T. Goswami,

Keyword(s):

Fatigue Crack ◽

Elevated Temperature ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Growth Data

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Midrange Fatigue Crack Growth Data Correlations for Structural Alloys at Room and Cryogenic Temperatures

Fatigue at Low Temperatures ◽

10.1520/stp32743s ◽

2008 ◽

pp. 5-5-23 ◽

Cited By ~ 1

Author(s):

RL Tobler ◽

Y-W Cheng

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Cryogenic Temperatures ◽

Growth Data ◽

Data Correlations

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Anomalous Fatigue Crack Growth Data Generated Using the ASTM Standards

Fatigue and Fracture Mechanics: 35th Volume ◽

10.1520/stp45540s ◽

2009 ◽

pp. 244-244-12

Author(s):

S. C. Forth ◽

J. C. Newman ◽

R. G. Forman

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Growth Data

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Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Journal of Electronic Packaging ◽

10.1115/1.1510863 ◽

2002 ◽

Vol 124 (4) ◽

pp. 385-390

Author(s):

Ki-Ju Kang ◽

Seon-Ho Choi ◽

Tae-Sung Bae

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Fatigue Tests ◽

Lap Joint ◽

Growth Data ◽

Micro Structure ◽

Crack Behavior ◽

Temperature Aging ◽

Near Threshold

Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed.

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