Thermoelastic damping in bilayer microbeam resonators with two-dimensional heat conduction

International Journal of Mechanical Sciences ◽

10.1016/j.ijmecsci.2019.105245 ◽

2020 ◽

Vol 167 ◽

pp. 105245 ◽

Author(s):

Longfei Yang ◽

Pu Li ◽

Yuming Fang ◽

Hongyue Zhou

Keyword(s):

Heat Conduction ◽

Two Dimensional ◽

Thermoelastic Damping

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Theoretical analysis of thermoelastic damping in bilayered circular plate resonators with two-dimensional heat conduction

International Journal of Mechanical Sciences ◽

10.1016/j.ijmecsci.2017.11.003 ◽

2018 ◽

Vol 135 ◽

pp. 114-123 ◽

Author(s):

Shoubin Liu ◽

Yuxin Sun ◽

Jingxuan Ma ◽

Jialing Yang

Keyword(s):

Heat Conduction ◽

Theoretical Analysis ◽

Circular Plate ◽

Two Dimensional ◽

Thermoelastic Damping

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Theory of Thermoelastic Damping in Micromechanical Resonators With Two-Dimensional Heat Conduction

Journal of Microelectromechanical Systems ◽

10.1109/jmems.2008.916316 ◽

2008 ◽

Vol 17 (2) ◽

pp. 494-502 ◽

Author(s):

S. Prabhakar ◽

S. Vengallatore

Keyword(s):

Heat Conduction ◽

Two Dimensional ◽

Thermoelastic Damping ◽

Micromechanical Resonators

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Thermoelastic Damping in Partially Covered Bilayer Microbeam Resonators with Two-Dimensional Heat Conduction

Journal of Sound and Vibration ◽

10.1016/j.jsv.2020.115863 ◽

2021 ◽

Vol 494 ◽

pp. 115863

Author(s):

Longfei Yang ◽

Pu Li ◽

Yuming Fang ◽

Xiao Ge

Keyword(s):

Heat Conduction ◽

Two Dimensional ◽

Thermoelastic Damping

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Thermoelastic Damping in the Axisymmetric Vibration of Circular Microplate Resonators with Two-Dimensional Heat Conduction

Journal of Thermal Stresses ◽

10.1080/01495739.2013.788406 ◽

2013 ◽

Vol 36 (8) ◽

pp. 830-850 ◽

Author(s):

Yuming Fang ◽

Pu Li ◽

Zhuo Wang

Keyword(s):

Heat Conduction ◽

Axisymmetric Vibration ◽

Two Dimensional ◽

Thermoelastic Damping ◽

Circular Microplate

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Thermoelastic damping in thin microrings with two-dimensional heat conduction

Physica E Low-dimensional Systems and Nanostructures ◽

10.1016/j.physe.2015.01.039 ◽

2015 ◽

Vol 69 ◽

pp. 198-206 ◽

Author(s):

Yuming Fang ◽

Pu Li

Keyword(s):

Heat Conduction ◽

Two Dimensional ◽

Thermoelastic Damping

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ALTERNATE APPLICATION OF REGULAR AND MODIFIED CONJUGATE GRADIENT METHOD TO TWO-DIMENSIONAL INVERSE HEAT CONDUCTION

Hybrid Methods in Engineering ◽

10.1615/hybmetheng.v1.i3.20 ◽

1999 ◽

Vol 1 (3) ◽

pp. 18

Author(s):

Woo-Seung Kim ◽

M. N. Ozisik ◽

Eui-Rak Choi

Keyword(s):

Heat Conduction ◽

Conjugate Gradient Method ◽

Conjugate Gradient ◽

Gradient Method ◽

Two Dimensional ◽

Inverse Heat Conduction ◽

Modified Conjugate Gradient Method

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On the solution to a two-dimensional boundary value problem of heat conduction in a degenerating domain

BULLETIN OF THE KARAGANDA UNIVERSITY-MATHEMATICS ◽

10.31489/2020m2/100-109 ◽

2020 ◽

Vol 98 (2) ◽

pp. 100-109

Author(s):

Minzilya T. Kosmakova ◽

◽

Valery G. Romanovski ◽

Dana M. Akhmanova ◽

Zhanar M. Tuleutaeva ◽

...

Keyword(s):

Heat Conduction ◽

Boundary Value Problem ◽

Boundary Value ◽

Two Dimensional ◽

Dimensional Boundary

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Two-Dimensional Inverse Transient Heat Conduction Analysis of Laminated Functionally Graded Circular Plates

Numerical Heat Transfer Part A Applications ◽

10.1080/10407782.2012.715987 ◽

2012 ◽

Vol 62 (12) ◽

pp. 992-1014 ◽

Author(s):

H. Rahideh ◽

P. Malekzadeh ◽

M. R. Golbahar Haghighi ◽

M. Vaghefi

Keyword(s):

Heat Conduction ◽

Transient Heat Conduction ◽

Functionally Graded ◽

Two Dimensional ◽

Circular Plates

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Numerical method for the solution of non-linear two-dimensional inverse heat conduction problem using unstructured meshes

International Journal for Numerical Methods in Engineering ◽

10.1002/(sici)1097-0207(20000630)48:6<881::aid-nme909>3.0.co;2-z ◽

2000 ◽

Vol 48 (6) ◽

pp. 881-899 ◽

Author(s):

Piotr Duda ◽

Jan Taler

Keyword(s):

Heat Conduction ◽

Numerical Method ◽

Heat Conduction Problem ◽

Unstructured Meshes ◽

Inverse Heat Conduction Problem ◽

Two Dimensional ◽

Inverse Heat Conduction ◽

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The solution of two-dimensional heat conduction problems for predicting operating temperature and power handling capabilities of hybrid circuits

Microelectronics Reliability ◽

10.1016/0026-2714(81)90504-7 ◽

1981 ◽

Vol 21 (2) ◽

pp. 287

Keyword(s):

Heat Conduction ◽

Operating Temperature ◽

Two Dimensional ◽

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