Boiling Heat Transfer Properties of Copper Surface with Different Microstructures

2021 ◽  
pp. 124589
Author(s):  
Liying Wang ◽  
Yonghua Wang ◽  
Wen Cheng ◽  
Huadong Yu ◽  
Jinkai Xu
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Copper Surface ◽  
Transfer Properties

Pool Boiling Heat Transfer of Water on Hydrophilic Surfaces With Different Wettability

2016 ◽  
Author(s):  
Adam R. Girard ◽  
Jinsub Kim ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Copper Surface ◽  
Contact Angles ◽  
Copper Surfaces ◽  
Nanoscale Structures ◽  
Flat Surfaces ◽  
Hydrophilic Surfaces ◽  
Alkali Solutions

The effect of wettability on boiling heat transfer (BHT) coefficient and critical heat flux (CHF) in pool boiling of water on hydrophilic surfaces having different contact angles was investigated. Hot alkali solutions were utilized to promote cupric and cuprous oxide growth which exhibited micro and nanoscale structures on copper surfaces, with thicknesses on the order of a couple of micrometers. These structure and surface energy variations result in different levels of wettability and roughness while maintaining the effusivity of the bare copper surface. The study showed that the BHT coefficient has an inverse relationship to wettability; the BHT coefficient decreases as wettability increases. Furthermore, it was shown that this dependency between BHT coefficient and wettability is more significant than the relationship between BHT coefficient and surface roughness. The CHF was also found to increase with increases in wettability and roughness. For the most hydrophilic surface tested in this study, CHF values were recorded near the 2,000 kW/m2 mark. This value is compared with maximum values reported in literature for water on non-structured flat surfaces without area enhancements. Based on these results it is postulated that there exists a true hydrodynamic CHF limit for pool boiling with water on flat surfaces, very near 2,000 kW/m2, independent of heater material, representing an 80% increase in the limit suggested by Zuber [1].

scholarly journals Film boiling heat transfer properties of liquid hydrogen flowing inside of heated pipe

2019 ◽  
Vol 502 ◽  
pp. 012090
Author(s):  
T Matsumoto ◽  
Y Shirai ◽  
M Shiotsu ◽  
K Fujita ◽  
Y Iwami ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Liquid Hydrogen ◽  
Film Boiling ◽  
Transfer Properties

Flow boiling heat transfer of R1234yf on a microparticle coated copper surface

2016 ◽  
Vol 22 (8) ◽  
pp. 1156-1166 ◽  
Author(s):  
Simone Mancin ◽  
Andrea Diani ◽  
Simone Vezzù ◽  
Luisa Rossetto
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Copper Surface ◽  
Flow Boiling Heat Transfer

scholarly journals Film Boiling Heat Transfer Properties of Liquid Hydrogen in Natural Convection

2015 ◽  
Vol 67 ◽  
pp. 643-648 ◽  
Author(s):  
Y. Horie ◽  
Y. Shirai ◽  
M. Shiotsu ◽  
T. Matsuzawa ◽  
K. Yoneda ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Boiling Heat Transfer ◽  
Liquid Hydrogen ◽  
Film Boiling ◽  
Transfer Properties

Pool Boiling Heat Transfer Enhancement of Water Using Brazed Copper Microporous Coatings

2015 ◽  
Author(s):  
Seongchul Jun ◽  
Hyoseong Wi ◽  
Ajay Gurung ◽  
Miguel Amaya ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Coating Thickness ◽  
Boiling Heat Transfer ◽  
Average Particle Size ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Heat Fluxes ◽  
Porous Coating ◽  
Average Particle ◽  
Nucleate Boiling Heat Transfer

A novel, high-temperature, thermally-conductive, microporous coating (HTCMC) is developed by brazing copper particles onto a copper surface. This coating is more durable than many previous microporous coatings and also effectively creates reentrant cavities by optimizing brazing conditions. A parametric study of coating thicknesses of 49–283 μm with an average particle size of ∼25 μm was conducted using the HTCMC coating to understand nucleate boiling heat transfer (NBHT) enhancement on porous surfaces. It was found that there are three porous coating regimes according to their thicknesses. The first regime is “microporous” in which both NBHT and critical heat flux (CHF) enhancements gradually grow as the coating thickness increases. The second regime is “microporous-to-porous transition” where NBHT is further enhanced at lower heat fluxes but decreases at higher heat fluxes for increasing thickness. CHF in this regime continues to increase as the coating thickness increases. The last regime is named as “porous”, and both NBHT and CHF decrease as the coating thickness increases further than that of the other two regimes. The maximum nucleate boiling heat transfer coefficient observed was ∼350,000 W/m2K at 96 μm thickness (“microporous” regime) and the maximum CHF observed was ∼2.1 MW/m2 at ∼225 μm thickness (“porous” regime).

scholarly journals Effect of Subcooling on Pool Boiling of Water from Sintered Copper Microporous Coating at Different Orientations

2018 ◽  
Vol 2018 ◽  
pp. 1-9 ◽  
Author(s):  
Seongchul Jun ◽  
Jinsub Kim ◽  
Seung M. You ◽  
Hwan Yeol Kim
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Average Particle Size ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Average Particle ◽  
Pool Boiling Heat Transfer ◽  
Microporous Coating ◽  
Plain Surface

The subcooling effect on pool boiling heat transfer using a copper microporous coating was experimentally studied in water for subcoolings of 10 K, 20 K, and 30 K at atmospheric pressure and compared to that of a plain copper surface. A high-temperature thermally conductive microporous coating (HTCMC) was made by sintering copper powder with an average particle size of 67 μm onto a 1 cm × 1 cm plain copper surface with a coating thickness of ~300 μm. The HTCMC surface showed a two times higher critical heat flux (CHF), ~2,000 kW/m2, and up to seven times higher nucleate boiling heat transfer (NBHT) coefficient, ~350 kW/m2K, when compared with a plain copper surface at saturation. The results of the subcooling effect on pool boiling showed that the NBHT of both the HTCMC and the plain copper surface did not change much with subcooling. On the other hand, the CHF increased linearly with the degree of subcooling for both the HTCMC and the plain copper surface. The increase in the CHF was measured to be ~60 kW/m2for every degree of subcooling for both the HTCMC and the plain surface, so that the difference of the CHF between the HTCMC and the plain copper surface was maintained at ~1,000 kW/m2throughout the tested subcooling range. The CHFs for the HTCMC and the plain copper surface at 30 K subcooling were 3,820 kW/m2and 2,820 kW/m2, respectively. The experimental results were compared with existing CHF correlations and appeared to match well with Zuber’s formula for the plain surface. The combined effect of subcooling and orientation of the HTCMC on pool boiling heat transfer was studied as well.

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