Pool Boiling Heat Transfer of Water on Hydrophilic Surfaces With Different Wettability

2016 ◽  
Author(s):  
Adam R. Girard ◽  
Jinsub Kim ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Copper Surface ◽  
Contact Angles ◽  
Copper Surfaces ◽  
Nanoscale Structures ◽  
Flat Surfaces ◽  
Hydrophilic Surfaces ◽  
Alkali Solutions

The effect of wettability on boiling heat transfer (BHT) coefficient and critical heat flux (CHF) in pool boiling of water on hydrophilic surfaces having different contact angles was investigated. Hot alkali solutions were utilized to promote cupric and cuprous oxide growth which exhibited micro and nanoscale structures on copper surfaces, with thicknesses on the order of a couple of micrometers. These structure and surface energy variations result in different levels of wettability and roughness while maintaining the effusivity of the bare copper surface. The study showed that the BHT coefficient has an inverse relationship to wettability; the BHT coefficient decreases as wettability increases. Furthermore, it was shown that this dependency between BHT coefficient and wettability is more significant than the relationship between BHT coefficient and surface roughness. The CHF was also found to increase with increases in wettability and roughness. For the most hydrophilic surface tested in this study, CHF values were recorded near the 2,000 kW/m2 mark. This value is compared with maximum values reported in literature for water on non-structured flat surfaces without area enhancements. Based on these results it is postulated that there exists a true hydrodynamic CHF limit for pool boiling with water on flat surfaces, very near 2,000 kW/m2, independent of heater material, representing an 80% increase in the limit suggested by Zuber [1].

Enhanced Pool Boiling Heat Transfer on Mono and Multi-Layer Micro-Nano Bi-Porous Copper Surfaces

2016 ◽  
Author(s):  
Ya-Qiao Wang ◽  
Dong-Chuan Mo ◽  
Shu-shen Lyu
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Copper Surface ◽  
Hysteresis Phenomenon ◽  
Copper Surfaces ◽  
Mono Layer ◽  
Porous Copper ◽  
Wall Superheat

Boiling heat transfer is widely used in industry and aerospace, and it can be enhanced by surface structure treatment. Here, two types of Micro-Nano bi-porous copper surfaces (MNBPCS) were prepared by hydrogen bubble template method and then sintered in reducing atmosphere. The effect of surface morphology on the saturated pool boiling of ultrapure water was investigated. Results show that, both NMBPCS have superior heat transfer performance to the plain copper surface. When the heat flux is 100W/cm2, the wall superheat of the two MNBPCS are about 7 and 9 °C lower than the plain copper surface respective. When the heat flux is lower than 130W/cm2, the wall superheat of the mono-layer MNBPCS is lower than that of the multi-layer one, because the bubbles formed on the mono-layer MNBPCS can departure more easily than those on the multi-layer one. When the heat flux is higher than 130W/cm2, the multi-layer MNBPCS has lower wall superheat than that of the mono-layer one, own to its better liquid accommodation from the morphology structure. Significant hysteresis phenomenon was only found on the Multi-layer MNBPCS. Its wall superheat keeps almost the same at about 13°C for its bottom layer structure with smaller cave diameter, when the heat flux is higher than 75W/cm2. The CHF of each MNBPCS is higher than 200W/cm2, and the multi-layer one is higher than the mono-layer one own to its better liquid accommodation from the morphology structure.

Experimental Verification of Analytical Prediction of Pool Boiling CHF Incorporating the Effects of EHD and Contact Angle

2015 ◽  
Author(s):  
Ichiro Kano ◽  
Takahiro Sato ◽  
Naoki Okamoto
Keyword(s):  
Heat Transfer ◽  
Contact Angle ◽  
Electric Field ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Contact Angles ◽  
Dielectric Liquid ◽  
Working Fluid ◽  
Analytical Prediction ◽  
Compound Effect

Boiling heat transfer enhancement via compound effect of Electro-Hydro-Dynamic (EHD) and contact angle has been experimentally and analytically investigated. A fluorinated dielectric liquid (Asahi Glass Co. Ltd, AE-3000) was selected as the working fluid. Pool boiling heat transfer in the saturated liquid was measured at atmospheric pressure. In order to change the contact angle between the boiling surface and the dielectric liquid, the different materials Cu, Cr, NiB, Sn, and mixture of 5 and 1.5 micro meter diamond particles were electrically deposited on a boiling surface. The critical heat flux (CHF) for different contact angles showed 20.5 ∼ 26.9 W/cm2 which was −7 ∼ 25 % of that for a non-coated Cu surface (21.5 W/cm2). Upon application of a −5 kV/mm electric field to the micro structured surface (the mixture of 5 and 1.5 micro meter particles), a CHF of 99 W/cm2 at a superheat of 33.5 K was obtained. The previous theoretical equation of pool boiling predicted the CHF with the electric field and without the electrode.

Influence of Copper Oxide on Femtosecond Laser Surface Processed Copper Pool Boiling Heat Transfer Surfaces

2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Corey Kruse ◽  
Alfred Tsubaki ◽  
Craig Zuhlke ◽  
Dennis Alexander ◽  
Mark Anderson ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Oxide Layer ◽  
Boiling Heat Transfer ◽  
Heat Transfer Performance ◽  
Pool Boiling ◽  
Laser Surface ◽  
Transfer Performance ◽  
Reference Surface ◽  
Copper Surfaces ◽  
Pool Boiling Heat Transfer

Pool boiling heat transfer with the use of femtosecond laser surface processing (FLSP) on copper surfaces has been studied. FLSP creates a self-organized micro/nanostructured surface. In the previous pool boiling heat transfer studies with stainless steel FLSP surfaces, enhancements in critical heat flux (CHF) and heat transfer coefficients (HTCs) were observed compared to the polished reference surface. However, this study shows that copper FLSP surfaces exhibit reductions in both CHF and HTCs consistently. This reduction in heat transfer performance is a result of an oxide layer that covers the surface of the microstructures and acts as an insulator due to its low thermal conductivity. The oxide layer was observed and measured with the use of a focused ion beam milling process and found to have thickness of a few microns. The thickness of this oxide layer was found to be related to the laser fluence parameter. As the fluence increased, the oxide layer thickness increased and the heat transfer performance decreased. For a specific test surface, the oxide layer was selectively removed by a chemical etching process. The removal of the oxide layer resulted in an enhancement in the HTC compared to the polished reference surface. Although the original FLSP copper surfaces were unable to outperform the polished reference curve, this experiment illustrates how an oxide layer can significantly affect heat transfer results and dominate other surface characteristics (such as increased surface area and wicking) that typically lead to heat transfer enhancement.

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