The root cause analysis of an oilwell blowout and explosion in the Middle East

Author(s):  
Rahman Ashena ◽  
Farzad Ghorbani ◽  
Muhammad Mubashir
2019 ◽  
Vol 289 ◽  
pp. 10003
Author(s):  
Rene Brueckner

The root cause analysis, determination of the extent of concrete defects and identification of an appropriate repair strategy can be straightforward, but it also often provides significant challenges to both contractors and engineers. The challenges can be due to a lack of QA/QC documentation, locally available investigation equipment, repair material and techniques and accepting actually feasible solutions. The paper presents a case study of a bridge in the Middle East where the root cause analysis was found to be straightforward but the determination of the extent of non-visible defects and the implementation of a feasible repair strategy proved to be much more complicated. The root cause analysis of the defects was carried out by visual inspection, representative intrusive investigations and a comprehensive document review. The determination of the extent of the defects using GPR techniques proved to be challenging under the local conditions. Even more difficulties were encountered by implementing the developed repair strategies to address the various defects to ensure that the required 120 years design life in a very aggressive environment can be achieved. Several revisions to the repair strategy were necessary to identify the most appropriate solution and to accelerate the programme.


2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda

Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.


Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.


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