In situ TEM characterization of interfacial reaction in Sn–3.5Ag/electroless Ni(P) solder joint

2011 ◽  
Vol 64 (7) ◽  
pp. 597-600 ◽  
Author(s):  
Han-Byul Kang ◽  
Jee-Hwan Bae ◽  
Jeong-Won Yoon ◽  
Seung-Boo Jung ◽  
Jongwoo Park ◽  
...  
2011 ◽  
Vol 17 (S2) ◽  
pp. 1572-1573 ◽  
Author(s):  
K Noh ◽  
L Sun ◽  
X Chen ◽  
J Wen ◽  
S Dillon

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.


2018 ◽  
Vol 24 (S1) ◽  
pp. 12-13
Author(s):  
Jiancun Rao ◽  
Xiaodong Zhang ◽  
Vasek Ocelik ◽  
David Vainchtein ◽  
Jeff T.M. De Hosson ◽  
...  

Author(s):  
M. J. Kim ◽  
S. Y. Park ◽  
D. K. Cha ◽  
J. Kim ◽  
H. C. Floresca ◽  
...  

Author(s):  
Arne Janssen ◽  
Nestor Zaluzec ◽  
Matthew Kulzick ◽  
Greg McMahon ◽  
M.G. Burke

2021 ◽  
Vol 27 (2) ◽  
pp. 250-256
Author(s):  
Supriya Koul ◽  
Le Zhou ◽  
Omar Ahmed ◽  
Yongho Sohn ◽  
Tengfei Jiang ◽  
...  

Abstract


2009 ◽  
Vol 15 (S2) ◽  
pp. 690-691
Author(s):  
A Yan ◽  
T Sun ◽  
VP Dravid

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009


2018 ◽  
Vol 24 (S1) ◽  
pp. 1886-1887
Author(s):  
Songhua Cai ◽  
Miao Wang ◽  
Xiaoqing Pan ◽  
J. Joshua Yang ◽  
Feng Miao ◽  
...  

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