Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology

2015 ◽  
Vol 57 ◽  
pp. 45-57 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor ◽  
I.A. Azid
Keyword(s):  
Response Surface Methodology ◽  
Response Surface ◽  
Interaction Analysis ◽  
Fluid Structure Interaction ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

scholarly journals Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

2014 ◽  
Vol 6 ◽  
pp. 275735 ◽  
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor ◽  
Z. M. Fairuz ◽  
A. M. Iqbal ◽  
...  
Keyword(s):  
Capillary Flow ◽  
Flow Behavior ◽  
Fluid Structure Interaction ◽  
Molten Solder ◽  
Circuit Board ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < d/ D < 0.97) were studied through a simulation modeling. The use of ratio d/ D = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to d/ D. Stress of pin varied quadratically with the d/ D. The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

scholarly journals Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

2014 ◽  
Vol 2014 ◽  
pp. 1-13 ◽  
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor
Keyword(s):  
Capillary Flow ◽  
Fluid Structure Interaction ◽  
Von Mises Stress ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Wave Soldering ◽  
Filling Time ◽  
Von Mises ◽  
Solder Temperature ◽  
Through Hole

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) <T< 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. TheΔTobtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.

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