Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing

2020 ◽  
Vol 152 ◽  
pp. 106576
Author(s):  
Chong Luo ◽  
Yi Xu ◽  
Nengyuan Zeng ◽  
Tengda Ma ◽  
Chenwei Wang ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Dodecylbenzenesulfonic Acid ◽  
Polyoxyethylene Ether ◽  
Nano Scale

Nano-scale scratching in chemical–mechanical polishing

CIRP Annals ◽  
2008 ◽  
Vol 57 (1) ◽  
pp. 341-344 ◽  
Author(s):  
N. Saka ◽  
T. Eusner ◽  
J.-H. Chun
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Nano Scale

A nano-scale mirror-like surface of Ti–6Al–4V attained by chemical mechanical polishing

2016 ◽  
Vol 25 (5) ◽  
pp. 058301 ◽  
Author(s):  
Chenliang Liang ◽  
Weili Liu ◽  
Shasha Li ◽  
Hui Kong ◽  
Zefang Zhang ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Nano Scale

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

scholarly journals Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

2021 ◽  
Author(s):  
Peili Gao ◽  
Tingting Liu ◽  
Zhenyu Zhang ◽  
Fanning Meng ◽  
Run-Ping Ye ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Ordered Mesoporous ◽  
Mesoporous Structures
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