chemical mechanical polishing process Recently Published Documents

Mechanical Polishing ◽

Polishing Process ◽

Development of Particle Detecting Technology for Measurement Slurry Particle Property in Chemical Mechanical Polishing Process

ECS Meeting Abstracts ◽

10.1149/ma2021-0120830mtgabs ◽

2021 ◽

Vol MA2021-01 (20) ◽

pp. 830-830

Author(s):

Chang min Kim ◽

Kihong Park ◽

Sanghcuk Jeon ◽

Taesung Kim

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Chemical Mechanical Polishing Process ◽

Particle Property

First-principles molecular dynamics investigation of ceria/silica sliding interface toward functional materials design for chemical mechanical polishing process

Applied Surface Science ◽

10.1016/j.apsusc.2020.147259 ◽

2020 ◽

Vol 530 ◽

pp. 147259 ◽

Cited By ~ 2

Author(s):

Tasuku Onodera ◽

Hitomi Takahashi ◽

Satoyuki Nomura

Keyword(s):

Molecular Dynamics ◽

First Principles ◽

First Principles Molecular Dynamics

Functional Materials ◽

Materials Design ◽

Mechanical Polishing ◽

Polishing Process ◽

Sliding Interface ◽

Chemical Mechanical Polishing Process ◽

Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

Tribology International ◽

10.1016/j.triboint.2020.106308 ◽

2020 ◽

Vol 148 ◽

pp. 106308

Author(s):

Song Yuan ◽

Xiaoguang Guo ◽

Junxin Huang ◽

Yonjun Gou ◽

Zhuji Jin ◽

...

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

Friction And Wear ◽

Dynamics Simulation ◽

Low Friction ◽

Polishing Process ◽

Reactive Molecular Dynamics ◽

Chemical Mechanical Polishing Process ◽

Insight Into

Run-to-Run Control of Chemical Mechanical Polishing Process Based on Deep Reinforcement Learning

IEEE Transactions on Semiconductor Manufacturing ◽

10.1109/tsm.2020.3002896 ◽

2020 ◽

Vol 33 (3) ◽

pp. 454-465

Author(s):

Jianbo Yu ◽

Peng Guo

Keyword(s):

Reinforcement Learning ◽

Mechanical Polishing ◽

Polishing Process ◽

3-D Modeling of Wafer Topography's Effect on Chemical Mechanical Polishing Process

ECS Transactions ◽

10.1149/1.3204411 ◽

2019 ◽

Vol 25 (3) ◽

pp. 233-241

Author(s):

Lixiao Wu ◽

Changfeng Yan

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

An Analytical Model of Contact Pressure Caused by 2-D Wafer Topography in Chemical-Mechanical Polishing Process

ECS Transactions ◽

10.1149/1.3694378 ◽

2019 ◽

Vol 44 (1) ◽

pp. 621-628

Author(s):

Lixiao Wu

Keyword(s):

Contact Pressure ◽

Analytical Model ◽

Mechanical Polishing ◽

Polishing Process ◽

Grinding and chemical mechanical polishing process for micropore x-ray optics fabricated with deep reactive ion etching

Applied Optics ◽

10.1364/ao.58.005240 ◽

2019 ◽

Vol 58 (19) ◽

pp. 5240 ◽

Cited By ~ 1

Author(s):

Aoto Fukushima ◽

Maiko Fujitani ◽

Kumi Ishikawa ◽

Masaki Numazawa ◽

Daiki Ishi ◽

...

Keyword(s):

Reactive Ion Etching ◽

Mechanical Polishing ◽

Polishing Process ◽

Ion Etching ◽

Ray Optics ◽

Deep Reactive Ion Etching ◽

X Ray ◽

Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process

Science China Technological Sciences ◽

10.1007/s11431-018-9414-6 ◽

2019 ◽

Vol 63 (1) ◽

pp. 166-172 ◽

Cited By ~ 2

Author(s):

BoCheng Jiang ◽

DeWen Zhao ◽

BingQuan Wang ◽

HuiJia Zhao ◽

YuHong Liu ◽

...

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Investigation of effects of pattern structures arrangement on chemical mechanical polishing process

2018 China Semiconductor Technology International Conference (CSTIC) ◽

10.1109/cstic.2018.8369259 ◽

2018 ◽

Author(s):

Lixiao Wu ◽

Sookap Hahn ◽

Changfeng Yan

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Pattern Structures ◽