Thin film deposition of an n-type organic semiconductor by ink-jet printing technique

2004 ◽  
Vol 450 (2) ◽  
pp. 312-315 ◽  
Author(s):  
Yuming Ai ◽  
Yi Liu ◽  
Tianhong Cui ◽  
Kody Varahramyan
2013 ◽  
Vol 284-287 ◽  
pp. 57-61
Author(s):  
Tsai Cheng Li ◽  
Rwei Ching Chang ◽  
Y.C. Li

With the advantage of simplicity and low cost, ink jet printing has the potential to replace the traditional chemical and physical deposition technology in thin film fabrication. In this work, silver conductive thin films are deposited on glass and polyimide substrates by ink jet printing, where some major characteristics of the printed thin films are investigated and compared to those deposited by sputtering. The micro texture and residual stresses of the thin films are measured with X-ray diffractometry (XRD). Using thin film scratch tester, the adhesion of thin films deposited by both ink jet printing and sputtering is studied. Further observations on electric and optical performance by using visible wavelength photospectrometry, four-point probe, and surface profiler are also discussed. The result shows that the micro texture of the printed thin film behaves as good as the sputtered thin film. Furthermore, the micro scratch result illustrates that the adhesion of the printed thin film is even better than the sputtered thin film. It emphasizes that, after certain baking process, the ink jet printing has the possibility to replace sputtering in thin film deposition, especially for the polymer substrates.


2013 ◽  
Vol 37 (3) ◽  
pp. 873-883 ◽  
Author(s):  
Tsai-Cheng Li ◽  
Rwei-Ching Chang ◽  
Yen-Choung Li

Silver conductive thin films deposited on glass and polyimide substrates by using ink jet printing are studied in this work. Characterization of the printed thin films and comparison with sputtered films are investigated. The micro texture, residual stress, adhesion, hardness, optical reflectance, and electric resistance of the thin films are discussed. The result shows that the ink jet printing has the possibility to replace sputtering in thin film deposition, especially for the polymer substrates.


2007 ◽  
Vol 91 (1) ◽  
pp. 346-349 ◽  
Author(s):  
Ahmed Mohamed El-Toni ◽  
Toshiaki Yamaguchi ◽  
Sota Shimizu ◽  
Yoshinobu Fujishiro ◽  
Masanobu Awano

2008 ◽  
Vol 516 (10) ◽  
pp. 3314-3319 ◽  
Author(s):  
Junjie Huang ◽  
Jianjun Yang ◽  
Wenrong Li ◽  
Wenbin Cai ◽  
Zhiyu Jiang

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