Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation

2010 ◽  
Vol 30 (11) ◽  
pp. 2299-2304 ◽  
Author(s):  
Yihui Zhou ◽  
Wenbiao Wu ◽  
Keqiang Qiu
Keyword(s):  
Printed Circuit Boards ◽  
Centrifugal Separation ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Vacuum Pyrolysis

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

2010 ◽  
Vol 177 (1-3) ◽  
pp. 626-632 ◽  
Author(s):  
Laishou Long ◽  
Shuiyu Sun ◽  
Sheng Zhong ◽  
Wencan Dai ◽  
Jingyong Liu ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Mechanical Processing ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Vacuum Pyrolysis

High-temperature centrifugal separation of Cu from waste printed circuit boards

2018 ◽  
Vol 199 ◽  
pp. 831-839 ◽  
Author(s):  
Long Meng ◽  
Yiwei Zhong ◽  
Lei Guo ◽  
Zhe Wang ◽  
Kuiyuan Chen ◽  
...  
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Centrifugal Separation ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

LEACHING OF METALS FROM WASTE PRINTED CIRCUIT BOARDS (WPCBs) USING SULFURIC AND NITRIC ACIDS

2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

scholarly journals Effective Recovery Process of Copper from Waste Printed Circuit Boards Utilizing Recycling of Leachate

JOM ◽  
2020 ◽  
Author(s):  
Joona Rajahalme ◽  
Siiri Perämäki ◽  
Roshan Budhathoki ◽  
Ari Väisänen
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
Printed Circuit Boards ◽  
Sulfuric Acid Concentration ◽  
Recovery Process ◽  
Copper Recovery ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Acid Consumption

AbstractThis study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.

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