Analysis of a rate-dependent cohesive model for dynamic crack propagation

2002 ◽  
Vol 70 (5) ◽  
pp. 685-704 ◽  
Author(s):  
Dhirendra V. Kubair ◽  
Philippe H. Geubelle ◽  
Yonggang Y. Huang
2017 ◽  
Vol 122 (11) ◽  
pp. 115102 ◽  
Author(s):  
Duc Hong Doan ◽  
Tinh Quoc Bui ◽  
Thom Van Do ◽  
Nguyen Dinh Duc

2012 ◽  
Vol 36 (5) ◽  
pp. 651-657 ◽  
Author(s):  
Jun Lei ◽  
Yue-Sheng Wang ◽  
Yifeng Huang ◽  
Qingsheng Yang ◽  
Chuanzeng Zhang

1998 ◽  
Vol 539 ◽  
Author(s):  
T. Cramer ◽  
A. Wanner ◽  
P. Gumbsch

AbstractTensile tests on notched plates of single-crystalline silicon were carried out at high overloads. Cracks were forced to propagate on {110} planes in a <110> direction. The dynamics of the fracture process was measured using the potential drop technique and correlated with the fracture surface morphology. Crack propagation velocity did not exceed a terminal velocity of v = 3800 m/s, which corresponds to 83%7 of the Rayleigh wave velocity vR. Specimens fractured at low stresses exhibited crystallographic cleavage whereas a transition from mirror-like smooth regions to rougher hackle zones was observed in case of the specimens fractured at high stresses. Inspection of the mirror zone at high magnification revealed a deviation of the {110} plane onto {111} crystallographic facets.


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