Electroless copper plating solution

2000 ◽  
Vol 98 (9) ◽  
pp. 116-117
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

scholarly journals Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution

2016 ◽  
Vol 9 (0) ◽  
pp. E16-001-1-E16-001-10
Author(s):  
Hiroshi Kanemoto ◽  
Toshinori Kawamura ◽  
Takeyuki Itabashi ◽  
Tomoyuki Miyazaki ◽  
Yoshihisa Kaneko
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

scholarly journals Determination of formaldehyde in electroless copper plating solution by potentiometric titration.

1990 ◽  
Vol 41 (4) ◽  
pp. 412-416
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Potentiometric Titration ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

scholarly journals Development of Formaldehyde Free Electroless Copper Plating Solution.

2002 ◽  
Vol 5 (3) ◽  
pp. 252-256 ◽  
Author(s):  
Takeyuki ITABASHI ◽  
Haruo AKAHOSHI ◽  
Tadashi IIDA ◽  
Eiji TAKAI ◽  
Naoki NISHIMURA
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper
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