scholarly journals Determination of formaldehyde in electroless copper plating solution by potentiometric titration.

1990 ◽  
Vol 41 (4) ◽  
pp. 412-416
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Potentiometric Titration ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

scholarly journals Indirect determination of pH in electroless copper plating bath by spectrophotometry.

1985 ◽  
Vol 36 (7) ◽  
pp. 289-290
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Plating Bath ◽  
Indirect Determination ◽  
Electroless Copper

scholarly journals Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution

2016 ◽  
Vol 9 (0) ◽  
pp. E16-001-1-E16-001-10
Author(s):  
Hiroshi Kanemoto ◽  
Toshinori Kawamura ◽  
Takeyuki Itabashi ◽  
Tomoyuki Miyazaki ◽  
Yoshihisa Kaneko
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

scholarly journals Development of Formaldehyde Free Electroless Copper Plating Solution.

2002 ◽  
Vol 5 (3) ◽  
pp. 252-256 ◽  
Author(s):  
Takeyuki ITABASHI ◽  
Haruo AKAHOSHI ◽  
Tadashi IIDA ◽  
Eiji TAKAI ◽  
Naoki NISHIMURA
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution
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