Transactions of The Japan Institute of Electronics Packaging
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TOTAL DOCUMENTS

241
(FIVE YEARS 43)

H-INDEX

10
(FIVE YEARS 1)

Published By Japan Institute Of Electronics Packaging

1884-8028, 1883-3365
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

scholarly journals Design and Heat-dissipation Characteristics of a Novel Spectrally Selective Thermal-radiation Material

2021 ◽  
Vol 14 (0) ◽  
pp. E20-006-1-E20-006-4
Author(s):  
Maki Ito ◽  
Takashi Ando ◽  
Naoki Maruyama ◽  
Takanobu Kobayashi ◽  
Yoshitaka Takezawa
Keyword(s):  
Thermal Radiation ◽  
Heat Dissipation ◽  
Spectrally Selective ◽  
Radiation Material

scholarly journals Compact Dual-band BPF Composed of LC J-inverters Using Lumped Elements

2021 ◽  
Vol 14 (0) ◽  
pp. E20-014-1-E20-014-10
Author(s):  
Taro Matsumura ◽  
Satoshi Ono ◽  
Koji Wada
Keyword(s):  
Dual Band ◽  
Lumped Elements

scholarly journals Message from the Editor

2021 ◽  
Vol 14 (0) ◽  
pp. Pref01_1-Pref01_1
Author(s):  
Osamu Suzuki

scholarly journals Maleimide Resin Blends with Enhanced Toughness for High-Temperature Semiconductor Packaging

2021 ◽  
Vol 14 (0) ◽  
pp. E21-001-1-E21-001-13
Author(s):  
Kazuhiro Kikuchi ◽  
Yasunori Karasawa ◽  
Yasutaka Watanabe ◽  
Takashi Sugino ◽  
Tadashi Suetsugu
Keyword(s):  
High Temperature ◽  
Semiconductor Packaging

scholarly journals Evolution of ECU Packaging for Motorcycles

2021 ◽  
Vol 14 (0) ◽  
pp. E21-006-1-E21-006-13
Author(s):  
Yuichi Takeda ◽  
Koji Inose ◽  
Daisuke Sugio ◽  
Tadao Kuboki ◽  
Syuichi Takioka ◽  
...  

scholarly journals Heat Dissipation Measurement of Electronic Component on PCB by Means of External Heater and Heat Flux Sensor

2021 ◽  
Vol 14 (0) ◽  
pp. E21-003-1-E21-003-10
Author(s):  
Zidi Li ◽  
Joao Vitor Thomsen Silveira ◽  
Kazuyoshi Fushinobu ◽  
Hiroki Nagamizo ◽  
Ryuta Yasui ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Dissipation ◽  
Electronic Component ◽  
Heat Flux Sensor ◽  
Flux Sensor
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