Surface texturing of large area multicrystalline silicon solar cells using reactive ion etching method

1997 ◽  
Vol 48 (1-4) ◽  
pp. 237-242 ◽  
Author(s):  
Y. Inomata ◽  
K. Fukui ◽  
K. Shirasawa
2013 ◽  
Vol 546 ◽  
pp. 275-278 ◽  
Author(s):  
Jinsu Yoo ◽  
Jun-Sik Cho ◽  
SeJin Ahn ◽  
Jihye Gwak ◽  
Ara Cho ◽  
...  

2013 ◽  
Vol 52 (3S) ◽  
pp. 03BD01 ◽  
Author(s):  
Kwang Mook Park ◽  
Myoung Bok Lee ◽  
Kyeong Su Jeon ◽  
Sie Young Choi

2013 ◽  
Vol 42 (6) ◽  
pp. 649-653
Author(s):  
豆维江 DOU Wei-jiang ◽  
秦应雄 QIN Ying-xiong ◽  
巨小宝 JU Xiao-bao ◽  
李锴 LI Kai ◽  
徐挺 XU Ting

Solar Energy ◽  
2003 ◽  
Author(s):  
Douglas S. Ruby ◽  
Saleem Zaidi ◽  
S. Narayanan ◽  
Satoshi Yamanaka ◽  
Ruben Balanga

We developed a maskless plasma texturing technique for multicrystalline Si (mc-Si) cells using Reactive Ion Etching (RIE) that results in higher cell performance than that of standard untextured cells. Elimination of plasma damage has been achieved while keeping front reflectance to low levels. Internal quantum efficiencies higher than those on planar and wet-textured cells have been obtained, boosting cell currents and efficiencies by up to 6% on tricrystalline Si cells.


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