Preparation of a Novel Silicone-Based Positive Photoresist and Its Application to an Image Reversal Process

Author(s):  
Akinobu Tanaka ◽  
Hiroshi Ban ◽  
Saburo Imamura
2011 ◽  
Vol 411 ◽  
pp. 474-477 ◽  
Author(s):  
Shuai Bao ◽  
Ai Hua Gao ◽  
Huan Liu ◽  
Wei Guo Liu

This paper describes a simple and effective lift-off method that relies upon a single layer of positive photoresist and lithography technology. We have succeeded in patterning narrow lines in a photoresist film by image reversal process. Image reversal with AZ 5214-E resist is characterized by contact lithography. A process of patterning different line widths was developed based on image reversal technology, using AZ5214-E, followed by pre-bake, exposure, reversal bake, flood exposure and development. We could obtain very neat patterns with 2-5μm dimensions and their relative features have been supported by scanning electron microscope (SEM) pictures. The application of the proposed process is suitable for the electrode fabrication in MEMS SAW devices.


1989 ◽  
Vol 28 (Part 1, No. 10) ◽  
pp. 2099-2103 ◽  
Author(s):  
Akinobu Tanaka ◽  
Hiroshi Ban ◽  
Yoshio Kawai

1989 ◽  
Vol 9 (1-4) ◽  
pp. 591-594 ◽  
Author(s):  
F. Pommereau ◽  
M. Iost ◽  
F. Vollenbroek ◽  
S. Gourrier

1978 ◽  
Vol 113 (2) ◽  
pp. 145-147 ◽  
Author(s):  
Curtis R. Brandt ◽  
Ronald Davis

1985 ◽  
Vol 32 (9) ◽  
pp. 1654-1661 ◽  
Author(s):  
H. Klose ◽  
R. Sigush ◽  
W. Arden

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