Microcrystalline and polycrystalline silicon films for solar cells obtained by gas-jet electron-beam PECVD method

2003 ◽  
Vol 150 (4) ◽  
pp. 293 ◽  
Author(s):  
R. Bilyalov ◽  
J. Poortmans ◽  
R. Sharafutdinov ◽  
S. Khmel ◽  
V. Schukin ◽  
...  
1981 ◽  
Vol 39 (8) ◽  
pp. 645-647 ◽  
Author(s):  
Kenji Shibata ◽  
Tomoyasu Inoue ◽  
Tadahiro Takigawa ◽  
Shintaro Yoshii

2019 ◽  
Vol 11 (5) ◽  
pp. 5554-5560 ◽  
Author(s):  
Thien N. Truong ◽  
Di Yan ◽  
Christian Samundsett ◽  
Rabin Basnet ◽  
Mike Tebyetekerwa ◽  
...  

2010 ◽  
Vol 49 (4) ◽  
pp. 04DP04 ◽  
Author(s):  
Keisuke Ohdaira ◽  
Tomoko Fujiwara ◽  
Yohei Endo ◽  
Kazuhiro Shiba ◽  
Hiroyuki Takemoto ◽  
...  

2007 ◽  
Vol 544-545 ◽  
pp. 471-474
Author(s):  
L. Fu ◽  
F. Gromball ◽  
J. Müller

Line shaped electron beam was used for the recrystallization of nanocrystalline silicon layer that had been deposited on the low cost borosilicate glass-substrate in this paper. Polycrystalline silicon films of a 20μm thickness, which are the base for a solar cell absorber, have been investigated. Tungstendisilicide (WSi2) was formed at the tungsten/silicon interface as well as grain boundaries of the silicon. WSi2 improved the wetting and adhesion of the silicon melt. The surface morphology of the film was strongly influenced by the recrystallization energy density applied. Low energy density resulted in non wetted WSi2/W areas due to the reaction between the silicon melt and the tungsten. With the increased energy, the capping layer become smooth and continuous due to the pinholes becomes fewer and smaller. Excess of the energy density led to larger voids in the capping layer, more WSi2/Si eutectic crystallites, a thinner tungsten layer, and a thicker tungstendisilicide layer.


Sign in / Sign up

Export Citation Format

Share Document