A remark on the Green's function for the face‐centered cubic lattices

1974 ◽  
Vol 15 (12) ◽  
pp. 2175-2176 ◽  
Author(s):  
Koichi Mano
Keyword(s):  
Green’S Function ◽  
Green's Function ◽  
Face Centered Cubic ◽  
Cubic Lattices ◽  
The Face ◽  
Face Centered

scholarly journals Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

Materials ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1593
Author(s):  
Xing Fu ◽  
Yunfei En ◽  
Bin Zhou ◽  
Si Chen ◽  
Yun Huang ◽  
...  
Keyword(s):  
Electron Backscatter Diffraction ◽  
Electrical Current ◽  
High Energy ◽  
Face Centered Cubic ◽  
Current Crowding ◽  
Cubic Lattices ◽  
Current Stressing ◽  
The Face ◽  
Face Centered ◽  
Solder Interface

Electromigration was characterized at the cathode Cu/solder interface—without the effect of Joule heating—by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cux,Ni1−x)6Sn5 intermetallic compound (IMC) growth was observed at the anomalous region at the cathode end due to the effect of current crowding. The abnormal isotropic diffusion and parallel distribution of Pb were characterized in an ultra-low temperature environment in a monocrystalline structure stressed at −196 °C. The interesting results were attributed to crystallographic transformation due to the simultaneous effect of cryogenic and electrical stressing. The diffusion behavior of Pb atoms in face-centered cubic lattices performed isomorphism. As a result, Pb atoms of the bump gathered at the high-energy grain boundaries by diffusing through the face-centered cubic lattices around the long grain boundary, eventually forming a long-range distribution and accumulation of Pb elements. Our study may provide understanding of cryogenic electromigration evolution of the Cu/solder interface and provide visual data for abnormal lattice transformation at the current stressing.

A study of interface sliding at F.C.C.-B.C.C. boundaries in a Cu-Zn alloy

1978 ◽  
Vol 36 (1) ◽  
pp. 422-423
Author(s):  
F. Monchoux ◽  
A. Rocher ◽  
J.L. Martin
Keyword(s):  
Face Centered Cubic ◽  
Creep Tests ◽  
High Voltage Electron Microscopy ◽  
Diffusion Treatment ◽  
Voltage Electron ◽  
The Face ◽  
Face Centered ◽  
Interface Sliding ◽  
Zn Alloy ◽  
Made In

Interphase sliding is an important phenomenon of high temperature plasticity. In order to study the microstructural changes associated with it, as well as its influence on the strain rate dependence on stress and temperature, plane boundaries were obtained by welding together two polycrystals of Cu-Zn alloys having the face centered cubic and body centered cubic structures respectively following the procedure described in (1). These specimens were then deformed in shear along the interface on a creep machine (2) at the same temperature as that of the diffusion treatment so as to avoid any precipitation. The present paper reports observations by conventional and high voltage electron microscopy of the microstructure of both phases, in the vicinity of the phase boundary, after different creep tests corresponding to various deformation conditions.Foils were cut by spark machining out of the bulk samples, 0.2 mm thick. They were then electropolished down to 0.1 mm, after which a hole with thin edges was made in an area including the boundary

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