A Better Understanding of the Through-Hole Plating of Printed Circuit Boards

1982 ◽  
Vol 60 (1) ◽  
pp. 131-136
Author(s):  
B.C. Jackson ◽  
J.R. House ◽  
S.K. Nagi
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Through Hole

Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles

Circuit World ◽  
2010 ◽  
Vol 36 (3) ◽  
pp. 9-13 ◽  
Author(s):  
A.J. Cobley ◽  
D.J. Comeskey ◽  
L. Paniwnyk ◽  
T.J. Mason
Keyword(s):  
Copper Nanoparticles ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Through Hole

The use of conducting polymers and colloids in the through hole plating of printed circuit boards

1994 ◽  
Vol 39 (8-9) ◽  
pp. 1325-1338 ◽  
Author(s):  
H. Meyer ◽  
R.J. Nichols ◽  
D. Schröer ◽  
L. Stamp
Keyword(s):  
Conducting Polymers ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Through Hole

scholarly journals Machine vision for automatic inspection of pin through hole components assembled on a PCB

2021 ◽  
Vol 6 (1) ◽  
pp. 091-098
Author(s):  
S Celaschi ◽  
MS de Castro ◽  
Alecio Fernandes ◽  
A.L. Xavier
Keyword(s):  
Machine Vision ◽  
Printed Circuit Boards ◽  
Assembly Line ◽  
Automatic Inspection ◽  
Circuit Boards ◽  
Classification Analysis ◽  
Printed Circuit ◽  
Desktop Computers ◽  
Industrial Assembly ◽  
Through Hole

Automatic and innovative equipment was developed to inspect the assembly of pin-through-hole components on printed circuit boards. Its performance was tested on an industrial assembly line of motherboards for desktop computers. The test was conducted to inspect, under the binomial criterion Pass/Fail, the process of inserting PTH-DIMM components on semi-finished PCBs. Using the concept of Inspection Accuracy in binomial classification analysis it was estimated that the accuracy of this inspection is greater than 98%.

scholarly journals Automated inspection of plated through-hole for printed circuit boards.

1990 ◽  
Vol 56 (5) ◽  
pp. 837-842
Author(s):  
Yasuhiko HARA ◽  
Hideaki DOI ◽  
Kiyoshi NUMATA ◽  
Kenzo ENDO ◽  
Satoshi SHINADA
Keyword(s):  
Printed Circuit Boards ◽  
Automated Inspection ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Through Hole

scholarly journals Thermal Fatigue Life of Through-hole Soldered Joints on Printed Circuit Boards.

1993 ◽  
Vol 8 (5) ◽  
pp. 380-394 ◽  
Author(s):  
Tasao SOGA ◽  
Hideaki SASAKI ◽  
Mitsugu SHIRAI ◽  
Tadao KUSHIMA
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Thermal Fatigue Life ◽  
Through Hole
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