2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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100

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H-INDEX

4

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Published By IEEE

9781467396905, 9781467383561

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Printed circuit board insertion loss measurement metrology comparison

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365202 ◽

2015 ◽

Author(s):

Jimmy Hsu ◽

Thonas Su ◽

Kai Xiao ◽

Xiaoning Ye ◽

Y. L. Li

Keyword(s):

Insertion Loss ◽

Printed Circuit Board ◽

Circuit Board ◽

Loss Measurement ◽

Printed Circuit

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Wafer level bumping technology for high voltage LED packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365183 ◽

2015 ◽

Author(s):

Tiwei Wei ◽

Xing Qiu ◽

Jeffery C. C. Lo ◽

S. W. Ricky Lee

Keyword(s):

High Voltage ◽

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A valid method to monitor gaseous contamination in data centers

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365208 ◽

2015 ◽

Author(s):

Dem Lee ◽

Jeffrey Lee ◽

Cheng Chih Chen ◽

Peggy Liou ◽

Alice Lin ◽

...

Keyword(s):

Data Centers ◽

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Organizer

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365169 ◽

2015 ◽

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Next generation copper pattern plating for IC package application

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365184 ◽

2015 ◽

Author(s):

Makoto Sakai ◽

Mutsuko Tamura ◽

Toshiyuki Morinaga ◽

Shinjiro Hayashi

Keyword(s):

Next Generation ◽

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Functionalization of carbon nanotubes with pyrene derivatives for electrostatic deposition on aminosilanized glass substrates

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365211 ◽

2015 ◽

Author(s):

Hung-Lun Liao ◽

Pen-Cheng Wang

Keyword(s):

Carbon Nanotubes ◽

Glass Substrates ◽

Electrostatic Deposition ◽

Pyrene Derivatives ◽

Functionalization Of Carbon Nanotubes

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A new approach to wafer sawing: stealth laser dicing technology

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365231 ◽

2015 ◽

Author(s):

Yen-Chi Lee ◽

Jyi-Tsong Lin

Keyword(s):

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Failure mode investigation of die pick process with high speed camera and numerical analysis

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365203 ◽

2015 ◽

Author(s):

De-Shin Liu ◽

Chieh-Jung Lu ◽

Cho-Liang Chung

Keyword(s):

Numerical Analysis ◽

Failure Mode ◽

High Speed Camera

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Mechanical strength of thin Cu-TSV memory dies used in 3D IC packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365247 ◽

2015 ◽

Author(s):

Y. C. Chao ◽

P. S. Huang ◽

H. T. Keng ◽

M. Y. Tsai ◽

P. C. Lin

Keyword(s):

Mechanical Strength ◽

3D Ic ◽

3D Ic Packaging ◽

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Reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365170 ◽

2015 ◽

Author(s):

CL. Gan ◽

U. Hashim

Keyword(s):

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