2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

100

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467396905, 9781467383561

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Organizer

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365169 ◽

2015 ◽

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Next generation copper pattern plating for IC package application

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365184 ◽

2015 ◽

Cited By ~ 1

Author(s):

Makoto Sakai ◽

Mutsuko Tamura ◽

Toshiyuki Morinaga ◽

Shinjiro Hayashi

Keyword(s):

Next Generation ◽

Ic Package

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Functionalization of carbon nanotubes with pyrene derivatives for electrostatic deposition on aminosilanized glass substrates

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365211 ◽

2015 ◽

Author(s):

Hung-Lun Liao ◽

Pen-Cheng Wang

Keyword(s):

Carbon Nanotubes ◽

Glass Substrates ◽

Electrostatic Deposition ◽

Pyrene Derivatives ◽

Functionalization Of Carbon Nanotubes

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A new approach to wafer sawing: stealth laser dicing technology

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365231 ◽

2015 ◽

Author(s):

Yen-Chi Lee ◽

Jyi-Tsong Lin

Keyword(s):

New Approach

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A valid method to monitor gaseous contamination in data centers

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365208 ◽

2015 ◽

Cited By ~ 1

Author(s):

Dem Lee ◽

Jeffrey Lee ◽

Cheng Chih Chen ◽

Peggy Liou ◽

Alice Lin ◽

...

Keyword(s):

Data Centers ◽

Valid Method

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Printed circuit board insertion loss measurement metrology comparison

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365202 ◽

2015 ◽

Cited By ~ 3

Author(s):

Jimmy Hsu ◽

Thonas Su ◽

Kai Xiao ◽

Xiaoning Ye ◽

Y. L. Li

Keyword(s):

Insertion Loss ◽

Printed Circuit Board ◽

Circuit Board ◽

Loss Measurement ◽

Printed Circuit

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Wafer level bumping technology for high voltage LED packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365183 ◽

2015 ◽

Cited By ~ 4

Author(s):

Tiwei Wei ◽

Xing Qiu ◽

Jeffery C. C. Lo ◽

S. W. Ricky Lee

Keyword(s):

High Voltage ◽

Wafer Level

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Effect of isothermal aging on microstructure and joint strength of Ag nanoporous bonding for high temperature die attach

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365186 ◽

2015 ◽

Cited By ~ 1

Author(s):

Min-Su Kim ◽

Hiroshi Nishikawa

Keyword(s):

High Temperature ◽

Isothermal Aging ◽

Joint Strength ◽

Die Attach

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Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365204 ◽

2015 ◽

Cited By ~ 1

Author(s):

Yao-Shing Chen ◽

Shih-Jue Lin ◽

Ben-Je Lwo

Keyword(s):

Thin Film ◽

Seebeck Coefficient ◽

Thermoelectric Materials

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Failure mode investigation of die pick process with high speed camera and numerical analysis

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2015.7365203 ◽

2015 ◽

Author(s):

De-Shin Liu ◽

Chieh-Jung Lu ◽

Cho-Liang Chung

Keyword(s):

Numerical Analysis ◽

Failure Mode ◽

High Speed ◽

High Speed Camera

Download Full-text

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Organizer

Next generation copper pattern plating for IC package application

Functionalization of carbon nanotubes with pyrene derivatives for electrostatic deposition on aminosilanized glass substrates

A new approach to wafer sawing: stealth laser dicing technology

A valid method to monitor gaseous contamination in data centers

Printed circuit board insertion loss measurement metrology comparison

Wafer level bumping technology for high voltage LED packaging

Effect of isothermal aging on microstructure and joint strength of Ag nanoporous bonding for high temperature die attach

Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment

Failure mode investigation of die pick process with high speed camera and numerical analysis

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications