Finite element analysis on the thermal fatigue life of full vs peripheral array packages

PurposeThis paper aims to examine the thermal cycling fatigue life performance of two-common solder array configurations, full and peripheral, using three-dimensional nonlinear finite element analysis.Design/methodology/approachThe finite element simulations were used to identify the location of the critical solder interconnect, and using Darveaux's model, solder thermal fatigue life was computed.FindingsThe results showed that the solder array type does not significantly influence thermal fatigue life of the interconnect. However, smaller size packages result in improved life by almost 45% compared to larger package designs. Additionally, this paper provided an engineered study on the effect of the number of rows available in a perimeter array component on solder thermal fatigue performance.Originality/valueGeneral design recommendations for reliable electronic assemblies under thermal cycling loaded were offered in this research.

Research on Thermal Fatigue Life Prediction Technology of PoP Laminated BGA Products

In this paper, a fast prediction method for thermal fatigue life of PoP laminated BGA Product was proposed. Firstly, the stress and strain of the solder joints of each layer of the laminated device in thermal fatigue test was determined by finite element simulation method. According to the research idea of relative stress and strain, the solder joints were divided into sensitive solder joints and reliable solder joints. Secondly, sensitive solder joint were connected with PCB traces through the internal pads, bonding wires, TSVs and reliable solder joints to form a daisy chain. Through real-time dynamic monitoring of the resistance change of the daisy chain in thermal fatigue test to judge whether the solder joints fail, and record the occurrence time of the first failure solder joint. Finally, the thermal fatigue life of the product was estimated by the Norris-Landzberg formula.

Thermal Fatigue Life Prediction under Temperature Uncertainty for Shot Sleeve of Squeeze Casting Machine

To quantify the influence of temperature uncertainty on thermal fatigue life prediction of a shot sleeve in an injection mechanism, an uncertainty analysis method based on a Kriging surrogate model and Monte Carlo simulation (MCS) was proposed. The training samples of the surrogate model were obtained by a finite element simulation, and the response relationships between input variables, such as pouring and preheating temperature, and target variables, such as strain and stress, were constructed by the Kriging surrogate model. The input variables were sampled by the MCS, and the predicted stress and strain parameters were combined with the modified universal slope equation to predict the thermal fatigue life of the shot sleeve. The statistical characteristics of the predicted life were obtained. The comparative analysis results indicate that the predicted life considering temperature uncertainty is more accurate than the deterministically predicted value.