Dielectric Properties and Leakage Current Characteristics of Sol-Gel Derived (Ba0.5Sr0.5)TiO3:MgTiO3 Thin Film Composites

2003 ◽  
Vol 30 (5-6) ◽  
pp. 99-107 ◽  
Author(s):  
M. Jain ◽  
S. B. Majumder ◽  
Yu. Yuzyuk ◽  
R. S. Katiyar ◽  
A. S. Bhalla ◽  
...  
2002 ◽  
Vol 81 (17) ◽  
pp. 3212-3214 ◽  
Author(s):  
M. Jain ◽  
S. B. Majumder ◽  
R. S. Katiyar ◽  
D. C. Agrawal ◽  
A. S. Bhalla

2016 ◽  
Vol 85 ◽  
pp. 50-58 ◽  
Author(s):  
C.L. Poh ◽  
M. Mariatti ◽  
Ahmad Fauzi Mohd Noor ◽  
Othman Sidek ◽  
T.P. Chuah ◽  
...  

2010 ◽  
Vol 1247 ◽  
Author(s):  
Manish Kumar ◽  
Shu Xiang ◽  
P. Markondeya Raj ◽  
Isaac Robin Abothu ◽  
Jin-Hyun Hwang ◽  
...  

AbstractThere is an increasing need for integrating high dielectric constant ceramic thin film components in organic and 3D IC packages to lower the power-supply impedance at high frequencies and supply noise-free power to the ICs. Sol-gel approach is very attractive for high density capacitors because of its ability to precisely control the composition of the films and the ease of introducing dopants to engineer the dielectric properties such as breakdown voltages and DC leakage characteristics. Thin films on copper foils lend themselves to organic package integration with standard foil lamination techniques used in package build-up processes. However, fabrication of thin film barium titanate on copper foils is generally affected by process incompatibility during crystallization in reducing atmospheres, leading to poor crystallization, oxygen vacancies and copper diffusion through the film that degrades the electrical properties.This paper focuses on the dielectric properties and electrical reliability of thin films on copper foils. Thin film (300-400 nm) embedded capacitors with capacitance density of 2 μF/cm2, low leakage current and high breakdown voltage were fabricated via sol-gel technology and foil lamination. To lower the leakage current, the chemical composition was altered by incorporating – 1.) Excess barium 2.) Acceptor dopants such as Mn. Both approaches lowered the leakage current compared to that of pure barium titanate. SEM analysis showed enhanced densification and refined grain structure with chemistry modification. The films showed good stability in leakage currents at 150 C with an applied field strength of 100 kV/cm, demonstrating the electrical reliability of these films.


2015 ◽  
Vol 1107 ◽  
pp. 119-124
Author(s):  
D.S. Saidina ◽  
M. Mariatti ◽  
J. Juliewatty

Polymer-ceramic composites have been pursued as the most promising dielectric materials for embedded capacitors in the organic package. In this study, ceramic fillers such as Calcium Copper Titanate (CCTO) was used to produce epoxy thin film composites for the purpose to replace capacitor made of ceramic materials. Spin coating technique was used to produce epoxy thin film composites. The effect of fillers loading on tensile and dielectric properties of the epoxy thin film composites were determined. Results showed that epoxy thin film with 20 vol% filler loading showed good dielectric properties. However, an increase of the fillers content caused reduction in the tensile properties due to filler agglomeration and voids. Dielectric constants and dielectric losses of epoxy/inorganic composite films generally increase with addition of filler.


Author(s):  
Rajathsing Kalusulingam ◽  
Sampath Gajula ◽  
Paulmanickam Koilraj ◽  
Duraikkannu Shanthana Lakshmi ◽  
Rajesh J. Tayade ◽  
...  

2014 ◽  
Vol 104 (2) ◽  
pp. 022904 ◽  
Author(s):  
A. Kulkarni ◽  
K. Meurisch ◽  
I. Teliban ◽  
R. Jahns ◽  
T. Strunskus ◽  
...  

2016 ◽  
Vol 133 (42) ◽  
Author(s):  
Parisa Hajighahremanzadeh ◽  
Mahsa Abbaszadeh ◽  
Seyyed Abbas Mousavi ◽  
Mohammad Soltanieh ◽  
Hadi Bakhshi

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