The influence of Yttrium on leakage current and dielectric properties of amorphous Al2O3 thin film derived by sol–gel

2016 ◽  
Vol 27 (8) ◽  
pp. 7788-7794 ◽  
Author(s):  
Manwen Yao ◽  
Pei Zou ◽  
Zhen Su ◽  
Jianwen Chen ◽  
Xi Yao
2003 ◽  
Vol 30 (5-6) ◽  
pp. 99-107 ◽  
Author(s):  
M. Jain ◽  
S. B. Majumder ◽  
Yu. Yuzyuk ◽  
R. S. Katiyar ◽  
A. S. Bhalla ◽  
...  

2010 ◽  
Vol 1247 ◽  
Author(s):  
Manish Kumar ◽  
Shu Xiang ◽  
P. Markondeya Raj ◽  
Isaac Robin Abothu ◽  
Jin-Hyun Hwang ◽  
...  

AbstractThere is an increasing need for integrating high dielectric constant ceramic thin film components in organic and 3D IC packages to lower the power-supply impedance at high frequencies and supply noise-free power to the ICs. Sol-gel approach is very attractive for high density capacitors because of its ability to precisely control the composition of the films and the ease of introducing dopants to engineer the dielectric properties such as breakdown voltages and DC leakage characteristics. Thin films on copper foils lend themselves to organic package integration with standard foil lamination techniques used in package build-up processes. However, fabrication of thin film barium titanate on copper foils is generally affected by process incompatibility during crystallization in reducing atmospheres, leading to poor crystallization, oxygen vacancies and copper diffusion through the film that degrades the electrical properties.This paper focuses on the dielectric properties and electrical reliability of thin films on copper foils. Thin film (300-400 nm) embedded capacitors with capacitance density of 2 μF/cm2, low leakage current and high breakdown voltage were fabricated via sol-gel technology and foil lamination. To lower the leakage current, the chemical composition was altered by incorporating – 1.) Excess barium 2.) Acceptor dopants such as Mn. Both approaches lowered the leakage current compared to that of pure barium titanate. SEM analysis showed enhanced densification and refined grain structure with chemistry modification. The films showed good stability in leakage currents at 150 C with an applied field strength of 100 kV/cm, demonstrating the electrical reliability of these films.


2006 ◽  
Vol 55 (4) ◽  
pp. 2069
Author(s):  
Jia Jian-Feng ◽  
Huang Kai ◽  
Pan Qing-Tao ◽  
Li Shi-Guo ◽  
He De-Yan

2019 ◽  
Vol 45 (9) ◽  
pp. 12285-12289 ◽  
Author(s):  
Y.Z. Wang ◽  
R.R. Liu ◽  
J. Qian ◽  
X.S. Sun ◽  
Y.J. Han ◽  
...  

1999 ◽  
Vol 169-170 ◽  
pp. 127-130
Author(s):  
Toshiyuki Hirano ◽  
Yoshiyuki Kondo ◽  
Hisao Suzuki ◽  
Syouko Ito ◽  
Saichirou Kaneko ◽  
...  

2002 ◽  
Vol 81 (17) ◽  
pp. 3212-3214 ◽  
Author(s):  
M. Jain ◽  
S. B. Majumder ◽  
R. S. Katiyar ◽  
D. C. Agrawal ◽  
A. S. Bhalla

2014 ◽  
Vol 538 ◽  
pp. 11-14
Author(s):  
Yang Lu Hou ◽  
Xing Hua Fu ◽  
Wen Hong Tao ◽  
Xin Jin

Mg-doped LaFeO3 thin film and Mg, Cr-doped La0.5Sr0.5FeO3 thin films were prepared by the sol-gel method. The change rules of structure and dielectric properties of the films were studied by XRD, SEM, and Agilent. The dielectric properties of La0.5Sr0.5FeO3 and LaFeO3 films were improved by the substitute with Mg and Cr. The doping amount of Mg and Cr for the optimal dielectric properties of La0.5Sr0.5FeO3 films is 45mol%, 25mol%, respectively, and for LaFeO3, the doping amount of Mg is 8mol%. The observed pure perovskite phase of the doped films suggested the dissolution of Mn, Co, and Ni in La0.5Sr0.5FeO3 crystal lattice. Mg and Cr were integrate in the lattice of LaFeO3 and La0.5Sr0.5FeO3, and mineral is single perovskite phase. The surface of the film is smooth, without cracks, surface grain size distribution and had uniform grain size.


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