electrical reliability
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Author(s):  
Yoshito Saito ◽  
Tomoyuki Nakamura ◽  
Kenichi Nada ◽  
Harunobu Sano ◽  
Isao Sakaguchi

Abstract This study investigates the possibility of hydrogen migration in BaTiO3-based dielectrics to improve the electrical reliability of multi-layer ceramic capacitors under conditions of high temperature, humidity, and electric field bias. It was observed that the deuterium in the dielectric drifted and migrated with the electric field, suggesting that deuterium exists as D+. The activation energy was found to be 0.34 eV, which is lower than that observed in previous studies. This finding offers a better understanding of the mechanism behind the migration of deuterium in a dielectric, which is highly relevant to future research in dielectrics and electronic components.


2021 ◽  
Vol 312 ◽  
pp. 08012
Author(s):  
Shahrokh Barati ◽  
Livio De Santoli ◽  
Gianluigi Lo Basso

This study deals with implementing an analytical model to simulate the energy performance associated with a Micro Gas Turbine when H2NG (Hydrogen Enriched Natural Gas) blends are used as fuel. The experimental campaign validated the simulation results at the actual operating conditions of the Micro Gas Turbine. The experimental campaign for model validation has been carried out over the spring and summer periods. Additionally, the MGT performance has been detected when fuelled H2NG with hydrogen fraction ranges between 0% vol. to 10% vol., with a 2% vol. Step., according to the main findings, the fuel consumption is reduced significantly. Also, heat recovery and electrical reliability improve slightly even though environmental factors influence the system. A numerical model was developed with MATLAB-Simulink to model the operation of the MGT. Thus, the relative standard errors affecting the main output parameters have been determined.


Materials ◽  
2019 ◽  
Vol 12 (20) ◽  
pp. 3288
Author(s):  
Quan Sun ◽  
Yebo Lu ◽  
Chengli Tang ◽  
Haijun Song ◽  
Chao Li ◽  
...  

Current-induced changes of surface morphology in printed Ag thin wires were investigated by current stressing tests and numerical simulation. The samples were printed Ag thin wires on a flexible substrate with input and output pads. Different experimentalresults were obtainedthroughchangingthe current density after current supply and the mechanism of those phenomena were investigated by numerical simulations based on the method of atomic flux divergence. Good agreement between the simulations and experimental results was reached. It was found that electromigration was the main factor that caused the change of the surface morphology. The contribution of thermal migration can be ignored, and the Joule heating lead by the supplied current had a very significant accelerating effect on electromigration. Guidelines for effectively changing the Ag thin wire surface through providing predetermined current density was proposed, which were expected to be useful for improving the electrical reliability and lifetime of printed Ag thin wires in flexible electronic devices.


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