Experimental investigation of deep-hole micro-drilling of glass using LIPAA process

Author(s):  
Naser Abbasi ◽  
Mohammad Reza Razfar ◽  
S. Mehdi Rezaei ◽  
Khosro Madanipour ◽  
Mohsen Khajehzadeh
2020 ◽  
Vol 35 (11) ◽  
pp. 1214-1227
Author(s):  
K. Venkatesan ◽  
S. Devendiran ◽  
Sai Chandra Sekhara Raju Bhupatiraju ◽  
Sathwik Kolluru ◽  
Chirla Pavan Kumar

2007 ◽  
Vol 364-366 ◽  
pp. 566-571
Author(s):  
Tae Il Seo ◽  
Dong Woo Kim ◽  
Myeong Woo Cho ◽  
Eung Sug Lee

Recently, the trends of industrial products move towards more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is required to perform more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multilayered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. The industries of precision production require smaller holes, high aspect ratio and high speed working for micro deep hole drilling. However the undesirable characteristics of micro drilling is the small signal to noise ratios, wandering motion of drill, high aspect ratio and the increase of cutting force as cutting depth increases. In order to optimize cutting conditions, an experimental study on the characteristics of micro deep hole machining processes using a tool dynamometer was carried out. And additionally, microscope with built-in an inspection monitor showed the relationship between burr in workpieces and chip form of micro drill machining.


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