Determination of allowable defect size in multimode polymer waveguides fabricated by printed circuit board compatible processes

2010 ◽  
Vol 20 (3) ◽  
pp. 035035 ◽  
Author(s):  
Han Seo Cho ◽  
Sang-Hoon Kim ◽  
Joon-Sung Kim ◽  
Jaehyun Jung
Keyword(s):  
Printed Circuit Board ◽  
Defect Size ◽  
Circuit Board ◽  
Polymer Waveguides ◽  
Printed Circuit

Fabrication and Performance Evaluation of Polymer Waveguides for Optical Printed Circuit Board Applications

2016 ◽  
Vol 36 (6) ◽  
pp. 0613001
Author(s):  
徐晓 Xu Xiao ◽  
马麟 Ma Lin ◽  
张文甲 Zhang Wenjia ◽  
杜江兵 Du Jiangbing ◽  
何祖源 He Zuyuan
Keyword(s):  
Performance Evaluation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polymer Waveguides ◽  
Printed Circuit ◽  
And Performance

Stereoimaging Determination of Strains in Surface Mounted Components and Plated Through Holes Resulting from Thermal Cycung

1991 ◽  
Vol 226 ◽  
Author(s):  
David L. Davidson
Keyword(s):  
Printed Circuit Board ◽  
High Spatial Resolution ◽  
Circuit Board ◽  
Depth Of Field ◽  
Scanning Microscope ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Microelectronic Components ◽  
Through Hole

AbstractThe experimental mechanics of microelectronics components requires high spatial resolution measurements that are best obtained by using the scanning microscope because of the high spacial resolution and depth of field obtained using this instrument. This paper describes how measurements made from photographs taken in the scanning electron microscope have been used successfully to determine the strains which develop due to differences in coefficient of thermal between various parts of microelectronic components. Results are presented for thermal strains in the solder joints of a surface mounted component and in a printed circuit board plated through hole.

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