New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

1994 ◽  
Vol 12 (11) ◽  
pp. 1963-1970 ◽  
Author(s):  
T. Hayashi ◽  
K. Katsura ◽  
H. Tsunetsugu
2005 ◽  
Vol 17 (1) ◽  
pp. 7-9 ◽  
Author(s):  
Julian Cheng ◽  
Chan-Long Shieh ◽  
Xiaodong Huang ◽  
Guoli Liu ◽  
M.V.R. Murty ◽  
...  

2015 ◽  
Vol 33 (6) ◽  
pp. 1235-1240 ◽  
Author(s):  
Koichi Hasebe ◽  
Tomonari Sato ◽  
Koji Takeda ◽  
Takuro Fujii ◽  
Takaaki Kakitsuka ◽  
...  

2009 ◽  
Vol 17 (24) ◽  
pp. 21986 ◽  
Author(s):  
F. Y. Gardes ◽  
A. Brimont ◽  
P. Sanchis ◽  
G. Rasigade ◽  
D. Marris-Morini ◽  
...  

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