New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics
1994 ◽
Vol 12
(11)
◽
pp. 1963-1970
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2019 ◽
Vol E102.C
(4)
◽
pp. 364-370
◽
Keyword(s):
2020 ◽
Vol E103.C
(8)
◽
pp. 381_e1-381_e1
Keyword(s):
Keyword(s):
2005 ◽
Vol 17
(1)
◽
pp. 7-9
◽
2015 ◽
Vol 33
(6)
◽
pp. 1235-1240
◽
Keyword(s):